News – Page 1670 – EEJournal

4DSP Brings Versatility and PCI Express Performance to VPX with FlexVPX

May 15, 2014 – AUSTIN, TX – 4DSP’s FlexVPX provides system designers with the flexibility and performance required for the most demanding applications. The ability to…

May 15, 2014

Monitor and Gather Smart Electricity Distribution Data Faster and More Accurately with Real-Time Measurements

San Jose, CA—May 14, 2014—Utilities and infrastructure providers can now simultaneously and accurately measure distributed power grid data with Petaluma, (MAXREFDES30#), a subsystem reference design from…

May 14, 2014

Element Six’s GaN-on-Diamond Wafers Proven by Raytheon to provide 3x improvement in power density vs GaN-on-SiC for RF Devices

14 May, 2014—Element Six, the world leader in synthetic diamond supermaterials and a member of the De Beers Group of Companies, today announced that its…

May 14, 2014

Archives: News

4DSP Brings Versatility and PCI Express Performance to VPX with FlexVPX

Monitor and Gather Smart Electricity Distribution Data Faster and More Accurately with Real-Time Measurements

Element Six’s GaN-on-Diamond Wafers Proven by Raytheon to provide 3x improvement in power density vs GaN-on-SiC for RF Devices

New Data Processing Board Offered By VadaTech Features High Performance and Low Latency

Xilinx Ships First Virtex UltraScale FPGA and Expands Industry’s Only 20nm High-End Family for 500G on a Single Chip

Leti MEMS Technology Part of Micro-needle Injection Device that Is Nominated for Medical Design Excellence Award

Thursday is Training Day at the 51st Design Automation Conference

FlexTech Alliance, Cal Poly Complete Screen Printing Study for Printed Electronics Applications

Next-generation automotive LED drivers for front and rear lights bring reliability and flexibility to exterior lighting

Applied Materials Introduces the Biggest Materials Change to Interconnect Technology in 15 Years