News – Page 1740 – EEJournal

DVSI Low Data Rate Speech Compression Software Available Now for Cadence Tensilica HiFi Audio/Voice DSP

SAN JOSE, CA–(Marketwired – December 10, 2013) – Cadence Design Systems, Inc. (NASDAQ: CDNS), a leader in global electronic design innovation, today announced that Digital Voice…

December 11, 2013

Imec Demonstrates Strained Germanium FinFETs at IEDM 2013

Washington D.C., USA – December 10, 2013 – At this week’s IEEE International Electron Devices Meeting (IEDM 2013), imec reported the first functional strained germanium (Ge) quantum-well…

December 10, 2013

Advanced Energy-Harvesting IC from STMicroelectronics Broadens Benefits of Battery-Free Technology

Geneva, December 10, 2013 – STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, is opening new avenues for energy-harvesting applications…

December 10, 2013

Xilinx Doubles Industry’s Highest Capacity Device to 4.4M Logic Cells, Delivering Density Advantage that is a Full Generation Ahead

SAN JOSE, Calif., Dec. 10, 2013 /PRNewswire/ — Xilinx, Inc. (NASDAQ: XLNX) today announced a new record breaking 4.4M logic cell device, more than doubling its industry leading highest…

December 10, 2013

Micron’s High-Density 45nm Serial NOR Flash Doubles Programming Speed for Embedded Applications

BOISE, Idaho, December 10, 2013 (GLOBE NEWSWIRE) — Micron Technology, Inc. (Nasdaq:MU), today announced the availability of 45nm Serial NOR Flash memory samples in 512Mb, 1Gb, and…

December 10, 2013

Xilinx 20nm All Programmable UltraScale Portfolio Now Available with ASIC-class Architecture and ASIC-strength Design Solution

SAN JOSE, Calif., Dec. 10, 2013 /PRNewswire/ — Xilinx, Inc. (NASDAQ: XLNX) today announced availability of its 20nm All Programmable UltraScale™ portfolio with product documentation and Vivado® Design…

December 10, 2013

Leti Presentation at IEDM 2013 Will Report Phase-Change Memory Developments for Microcontroller Embedded Applications

GRENOBLE, France – Dec. 6, 2013 – A CEA-Leti and STMicroelectronics paper at IEDM 2013 in December will present an innovative back-end-of-line (BEOL), phase-change memory…

December 9, 2013

Abilis Systems Achieves First-Pass Silicon Success with DesignWare ARC Processors, Interface IP and Synopsys Professional Services

MOUNTAIN VIEW, Calif., Dec. 9, 2013 /PRNewswire/ — Highlights: Achieved first-pass silicon success for its secure media processor using Synopsys’ DesignWare ARC Processors, Interface IP, Embedded Memories…

December 9, 2013

New Accurate Temperature Sensors Now Offered by Oven Industries Inc

Oven Industries, Inc. offers a wide variety of accurate temperature sensors, from thermistors and thermocouples, to resistance thermometers. From ensuring accuracy and ensuring that the…

December 6, 2013

Imagination Technologies and Express Logic Partner to Expand Already Broad ThreadX RTOS Support for MIPS CPUs

LONDON, Dec. 5, 2013 (GLOBE NEWSWIRE) — Imagination Technologies (IMG.L) and Express Logic announce expanded support of Express Logic’s popular ThreadX(R) RTOS (real time operating system) for…

December 6, 2013

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