News – Page 1766 – EEJournal

CEVA Introduces the CEVA-XC4500, the World’s First Vector Floating-Point DSP for Wireless Infrastructure Solutions

MOUNTAIN VIEW, Calif., October 16, 2013 – CEVA, Inc. (NASDAQ: CEVA), the leading licensor of DSP cores and platform solutions, today introduced the CEVA-XC4500 DSP – the world’s first…

October 21, 2013

TI introduces industry’s first analog DC/DC controller with dynamic temperature-compensated inductor current sensing

DALLAS (October 21, 2013) – Texas Instruments (TI) (NASDAQ: TXN) today introduced the first analog DC/DC step-down controller with remote bipolar junction transistor (BJT) temperature-compensated…

October 21, 2013

IDT Announces Third-generation High-performance, Programmable Universal Frequency Translator for 100 Gbps Interfaces

SAN JOSE, Calif., October 17, 2013 – Integrated Device Technology, Inc. (IDT®) (NASDAQ: IDTI), the Analog and Digital Company™ delivering essential mixed-signal semiconductor solutions, today announced the third…

October 21, 2013

Cadence to Unveil New IO-SSO Analysis Suite at EPEPS Conference

SAN JOSE, CA–(Marketwired – October 21, 2013) – Cadence Design Systems, Inc. (NASDAQ: CDNS), a leader in global electronic design innovation, will give the first public demonstrations…

October 21, 2013

Xilinx and TSMC Reach Volume Production on all 28nm CoWoS™-based All Programmable 3D IC Families

SAN JOSE, Calif. and HSINCHU, Taiwan – Oct. 21, 2013 – Xilinx Inc. (NASDAQ: XLNX) and TSMC (TWSE: 2330, NYSE: TSM) today announced production release of…

October 21, 2013

Atollic leads industry with launch of first embedded IDE with code testing and quality management features as standard

Jonkoping, Sweden 21/10 2013 – Atollic today announced the launch of TrueSTUDIO Premium edition. Built on the well-established TrueSTUDIO Pro, a powerful IDE for embedded…

October 21, 2013

VIA Technologies Licenses Cadence Tensilica HiFi Audio/Voice DSP

SAN JOSE, CA–(Marketwired – October 21, 2013) – Cadence Design Systems, Inc. (NASDAQ: CDNS), a leader in global electronic design innovation, today announced that Taiwan-based VIA Technologies…

October 21, 2013

MEMS Technology Showcase Finalists Highlight “MEMS Inside the Machine”

MEMS Technology Showcase® will give MEMS Executive Congress US® attendees an intimate look at some of the most unique and inspiring MEMS-enabled applications in the business. After…

October 21, 2013

PCB Piezotronics Introduces Miniature Precision Pressure Sensor

October 18, 2013, Depew, N.Y., USA – PCB Automotive Sensors, a division of PCB Piezotronics, Inc., introduces a miniature pressure sensor for achieving highly accurate pressure measurements in thermodynamic applications such…

October 21, 2013

Newark element14 Launches Portal to Build and Promote New BoosterPacks for TI’s MCU LaunchPads

October 18, 2013 – CHICAGO – Newark element14 has launched its new portal “Build Your Own BoosterPack” to provide supporting resources for design engineers creating their own BoosterPack and…

October 21, 2013

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