News – Page 1788 – EEJournal

Industry-unique Faroudja® Transcoding Technology from STMicroelectronics Connects Digital Homes to Everything, Everywhere, All the Time

Geneva, September 12, 2013 – STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, has introduced the industry’s first transcoding engine that enables…

September 12, 2013

Microsemi 750 Watt GaN on SiC RF Power Transistor Delivers Unparalleled High-power Performance for Aviation Applications

ALISO VIEJO, Calif.—Sept. 12, 2013—Microsemi Corporation (Nasdaq: MSCC), a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, today expanded its family…

September 12, 2013

Plug-and-play: New low-cost MSP430™ USB LaunchPad and NFC BoosterPack let developers tap into the Internet of Things (IoT)

DALLAS (September 12, 2013) – Designed with input from the engineering and maker communities, Texas Instruments (TI) (NASDAQ: TXN) today announced the highly anticipated MSP430™ USB…

September 12, 2013

Soitec launches new solar-energy module featuring 31.8% efficiency – The highest of any commercial module being mass produced today

Bernin (Grenoble), France, September 11, 2013 — Soitec (Euronext), a world leader in generating and manufacturing revolutionary semiconductor materials for the electronics and energy industries, today…

September 12, 2013

New PCB Design Libraries for Linear Technology feature Altium 3D CAD Data and Real Time Supply Chain Information

Shanghai, China – 12 September 2013 – Altium Limited, a global leader in Smart System Design Automation and provider of solutions for 3D PCB design…

September 12, 2013

ADLINK Launches Latest ATCA Blade with Refreshed Intel® Xeon® E5-2600 v2 processor and Intel® Communications Chipset 8920

September 10, 2013 – San Francisco, CA – Intel Developer Forum – ADLINK Technology, Inc., a leading provider of trusted telecom computing products, today announced availability of…

September 11, 2013

Archives: News

Industry-unique Faroudja® Transcoding Technology from STMicroelectronics Connects Digital Homes to Everything, Everywhere, All the Time

Microsemi 750 Watt GaN on SiC RF Power Transistor Delivers Unparalleled High-power Performance for Aviation Applications

Plug-and-play: New low-cost MSP430™ USB LaunchPad and NFC BoosterPack let developers tap into the Internet of Things (IoT)

Soitec launches new solar-energy module featuring 31.8% efficiency – The highest of any commercial module being mass produced today

New PCB Design Libraries for Linear Technology feature Altium 3D CAD Data and Real Time Supply Chain Information

ADLINK Launches Latest ATCA Blade with Refreshed Intel® Xeon® E5-2600 v2 processor and Intel® Communications Chipset 8920

HDL Design House MIPI CSI-2 TX IP core successfully integrated into Fujitsu APIX® Companion Chip

Real Intent to Exhibit at SNUG Designer Community Expo in Austin on Sept. 18

Berkeley Design Automation Signs Key Customer for CMOS Image Sensor Verification with Analog FastSPICE™ Platform

Cryptography Research and ALi Corporation Sign Architecture License Agreement for DPA Countermeasures