News – Page 1793 – EEJournal

Avnet Embedded and Wind River Announce Distribution Agreement in the Americas

ALAMEDA, Calif. & PHOENIX— September 4, 2013 — Wind River®, a world leader in embedded and mobile software, has entered into a distribution agreement with Avnet Embedded,…

September 4, 2013

Altera and Micron Lead Industry with FPGA and Hybrid Memory Cube Interoperability

San Jose, Calif., and Boise, Idaho, September 4, 2013—Altera Corporation (NASDAQ: ALTR) and Micron Technology, Inc. (NASDAQ: MU) (“Micron”) today announced they have jointly demonstrated successful…

September 4, 2013

TI introduces RS-485 transceiver with fastest automatic polarity correction

DALLAS (Sept. 3, 2013) – Texas Instruments (TI) (NASDAQ: TXN) today introduced a low-power, half-duplex RS-485 transceiver with the fastest automatic bus-polarity correction time. In…

September 4, 2013

SMIC Adopts Cadence Digital Flow with Advanced Features for Improving Area, Power and Performance

Highlights: SMIC’s new 40nm Reference Flow 5.1 incorporates the state-of-the-art Cadence CCOpt and GigaOpt technology and the Tempus Timing Signoff Solution The new RTL-to-GDSII digital…

September 4, 2013

Sand 9 Challenges Dominance of Quartz Timing Devices in Mobile Applications

CAMBRIDGE, Mass. – September 3, 2013 – Sand 9, Inc., today announced the first micro-electromechanical systems (MEMS) timing products specifically designed to meet the stringent performance, cost, size…

September 3, 2013

+36dBm IIP3 Downconverting Mixer with Unprecedented 2.4dB Conversion Gain

MILPITAS, CA – September 3, 2013 – Linear Technology announces the LTC5551, an ultrahigh dynamic range RF down-converting mixer for applications that demand the very best…

September 3, 2013

MEMS and Sensors Summit Brings Industry Leaders Together to Share Opportunities to Shape the Future of Electronics

Geneva, September 3, 2013 – STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, is joining with sponsors Berkeley Sensor and Actuator Center,…

September 3, 2013

Amicra to Demonstrate Advanced Die and Flip Chip Bonders at Semicon Taiwan 2013

Regensburg, Germany, 03 September 2013 — Amicra Microtechnologies GmbH, a worldwide leading provider of high-precision micro-assembly equipment and customized electronics manufacturing solutions, comes to this year’s Semicon…

September 3, 2013

New and Improved Tandem Diodes from STMicroelectronics Deliver Economical Alternative to Silicon Carbide

Geneva, September 3, 2013 – STMicroelectronics has unveiled its second generation of tandem diodes, which enable designers to cost-effectively enhance the energy efficiency of equipment such as power…

September 3, 2013

Advanced Wireless Selects the Mentor Graphics Calibre Platform for Verification of Advanced GaAs Wireless ICs

WILSONVILLE, Ore., September 3, 2013—Mentor Graphics Corp. (NASDAQ: MENT) today announced that Advanced Wireless Semiconductor Company (AWSC) has selected the Calibre® nmDRC™ and nmLVS™ products as…

September 3, 2013

Archives: News