Archives: News
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Infineon unveils the world’s thinnest silicon power wafer, pushing technical boundaries and improving energy efficiency
Infineon first to master handling and processing of ultra-thin 20-micrometer power semiconductor wafers Reducing wafer thickness cuts substrate resistance in half, enabling power loss reductions…
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NSM211x Series High-Precision AEC-Q100 Current Sensors Eliminate Need for External Isolation Components
October 29, 2024, Shanghai – NOVOSENSE Microelectronics, a semiconductor company specializing in high-performance analog and mixed-signal chips, has announced the NSM211x, a series of automotive-grade fully integrated…
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Siemens and CELUS collaborate to empower SMBs with AI-powered PCB design
Siemens Digital Industries Software, a global leader in PCB electronic systems design, and CELUS, a pioneer in AI-powered electronic design automation solutions, today announced their…
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MIPI Alliance Releases Camera Security Specifications for Flexible End-to-End Protection of Automotive Image Sensor Data
BRIDGEWATER, N.J., October 29, 2024—The MIPI Alliance, an international organization that develops interface specifications for mobile and mobile-influenced industries, today announced the release of the MIPI Camera Security…
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Arteris Selected by TIER IV for Intelligent Vehicles
CAMPBELL, Calif. – October 29, 2024 – Arteris, Inc. (Nasdaq: AIP), a leading provider of system IP which accelerates system-on-chip (SoC) creation, today announced TIER…
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STMicroelectronics’ innovative biosensing technology enables next-generation wearables for individual healthcare and fitness
Highly integrated biosensor device combines input channel for cardio and neurological sensing with motion tracking and embedded AI core Demonstration to take place at Electronica…