News – Page 1827 – EEJournal

Cost-Efficient COM Express™ Type 6 Modules with Celeron CPUs

Stutensee, Germany – MSC Vertriebs GmbH has expanded its high-end MSC C6B-7S COM Express™ Type 6 module family based on third generation Intel® Core™ processors (Ivy…

June 26, 2013

Leti Develops Lens-Free Imaging Technique that Dramatically Extends Research Capabilities into Cells, Bacteria and Viruses

GRENOBLE, France – June 26, 2013 – CEA-Leti today introduced a new video lens-free imaging technique that redefines bio imaging, provides significant advantages over traditional…

June 26, 2013

Agilent Technologies Introduces FPGA Development Kit for High-Speed Digitizers Powered by Mentor Graphics

SANTA CLARA, Calif., June 25, 2013 – Agilent Technologies Inc. (NYSE: A) today introduced the U5340A FPGA development kit, powered by a customMentor Graphics design engine, for high-speed digitizers. The…

June 26, 2013

Synopsys and UMC Collaborate to Accelerate Development of UMC’s 14-nm FinFET Process

HSINCHU, Taiwan and MOUNTAIN VIEW, Calif., June 26, 2013 /PRNewswire/ — Highlights First collaboration milestone speeds validation of IP and design correlation on UMC’s 14-nm FinFET process…

June 26, 2013

IAR Systems launches updated version of tools for Renesas M16C and R8C

Uppsala, Sweden—June 26, 2013—Today, IAR Systems® releases a new version of its development toolchain IAR Embedded Workbench® for Renesas M16C and R8C. Developers working with…

June 26, 2013

TI introduces SafeTI™ Compiler Qualification Kit to help ease functional safety development for industrial, automotive and medical products

DALLAS, TX (June 26, 2013) – Adding to its SafeTI™ design packages, Texas Instruments Incorporated (TI) (NASDAQ: TXN) today introduces its new SafeTI™ Compiler Qualification Kit. The SafeTI™ Compiler Qualification Kit assists customers…

June 26, 2013

Innovative Smart-Meter Device from STMicroelectronics Simplifies Interoperability, Enabling Massive Roll-Outs by Utilities

Geneva, June 26, 2013 – STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, has announced the world’s first smart-meter integrated circuit…

June 26, 2013

Archives: News

Cost-Efficient COM Express™ Type 6 Modules with Celeron CPUs

Leti Develops Lens-Free Imaging Technique that Dramatically Extends Research Capabilities into Cells, Bacteria and Viruses

Agilent Technologies Introduces FPGA Development Kit for High-Speed Digitizers Powered by Mentor Graphics

Synopsys and UMC Collaborate to Accelerate Development of UMC’s 14-nm FinFET Process

IAR Systems launches updated version of tools for Renesas M16C and R8C

TI introduces SafeTI™ Compiler Qualification Kit to help ease functional safety development for industrial, automotive and medical products

Innovative Smart-Meter Device from STMicroelectronics Simplifies Interoperability, Enabling Massive Roll-Outs by Utilities

Tektronix to Adopt IBM’s 9HP SiGe Technology in Next Generation 70GHz Oscilloscopes

Microchip’s New Family of High-Speed CAN Transceivers Are Low Power and Highly Robust

Veeco to Host MEMS Technical Seminar