News – Page 1839 – EEJournal

Analog Devices’ MEMS Wireless Vibration Sensing System Enables Remote Monitoring of Industrial Machine Health

NORWOOD, Mass.– Analog Devices, Inc. (ADI) today introduced a wireless vibration sensing system that allows industrial systems operators to remotely monitor production equipment health, improve…

June 5, 2013

Atrenta Ships 5.1 Release of SpyGlass® Platform

SAN JOSE, Calif — Jun 5, 2013 — Atrenta Inc., the leading provider of SoC Realization solutions for the semiconductor and consumer electronics industries, announced today the 5.1…

June 5, 2013

IAR Systems adds major new functionality to simplify development for Renesas V850 MCUs

Uppsala, Sweden – June 4, 2013 – Today, IAR Systems® launches a new version of its high-performance development tool suite IAR Embedded Workbench® for V850.…

June 5, 2013

Atmel Licenses Sensinode’s 6LoWPAN Software Stack for Use in Ultra-Low Power Wireless Hardware Platforms

San Jose, CA, June 5, 2013 – Atmel® Corporation (NASDAQ: ATML), a leader in microcontroller (MCU) and touch technology solutions, today announced the company has signed an…

June 5, 2013

MEMSIC Introduces High-Performance Two-Axis Magnetic Sensor at Sensors Expo 2013

ROSEMONT, Ill., June 5, 2013 (GLOBE NEWSWIRE) — MEMSIC Inc. (Nasdaq:MEMS), a leading sensor solution provider, announced today at Sensors Expo (Booth #417) the availability…

June 5, 2013

Ayla Networks Raises $5.4 Million, Unveils Platform to Allow Manufacturers to Create a New Generation of Connected Devices

June 5, 2013—Sunnyvale, Calif.—Ayla Networks, a leader in technology and cloud-based services for the Internet of Things, formally unveiled the Ayla Platform, which allows manufacturers…

June 5, 2013

Archives: News

Analog Devices’ MEMS Wireless Vibration Sensing System Enables Remote Monitoring of Industrial Machine Health

Atrenta Ships 5.1 Release of SpyGlass® Platform

IAR Systems adds major new functionality to simplify development for Renesas V850 MCUs

Atmel Licenses Sensinode’s 6LoWPAN Software Stack for Use in Ultra-Low Power Wireless Hardware Platforms

MEMSIC Introduces High-Performance Two-Axis Magnetic Sensor at Sensors Expo 2013

Ayla Networks Raises $5.4 Million, Unveils Platform to Allow Manufacturers to Create a New Generation of Connected Devices

GLOBALFOUNDRIES demonstrates 3D TSV capabilities on 20nm technology

Epitaxial SiC Films Grown on 300mm Si Wafers

ADLINK Introduces High Quality Visual Solutions Across Form Factors with 4th Generation Intel® Core™ Processor

Teledyne DALSA Announces MEMS Integrated Design for Inertial Sensors (MIDIS™) Platform