News – Page 1879 – EEJournal

Tektronix Continues Expansion of Gold Care Service Plans

BEAVERTON, Ore., March 2013 – Tektronix Inc., the world’s leading manufacturer of oscilloscopes, has announced the continued expansion of its successful Gold Care Service Plans. This latest…

March 21, 2013

TI speeds and simplifies design of automotive emergency call systemswith new reference design

DALLAS (March 20, 2013) – Texas Instruments Incorporated (TI) (NASDAQ: TXN) today introduced a complete reference design that provides designers all the analog and embedded…

March 21, 2013

NXP Unveils GreenChip for Compact, Energy-Efficient Mobile Charging

Eindhoven, Netherlands and Long Beach, California, March 20, 2013 – While the line between “smartphones” and “tablets” becomes increasingly blurry, it’s clear that the charger for…

March 21, 2013

QuickLogic’s ArcticLink III VX6 Supports Embedded and External Displays from a Single Processor Display Output

Drive on-board display and HDMI/MHL transmitters from a single Application Processor display signal Includes display bridging functions for seamless connectivity of varying interfaces Integrated VEE…

March 20, 2013

IAR Systems makes major updates to leading tools for low-power Renesas MCUs

Uppsala, Sweden—March 19, 2013—Today, IAR Systems® releases a new version of its development tool suite IAR Embedded Workbench for Renesas RL78. The new version 1.30…

March 20, 2013

TI’s flyback controller surpasses Energy Star 5 standby power requirementsfor 10- to 65-W AC adapters

DALLAS (March 19, 2013) – Expanding its line of energy-efficient, no-load adapter power controllers, Texas Instruments Incorporated (TI) (NASDAQ: TXN) today announced the industry’s first…

March 20, 2013

RoweBots MCU Wireless Connectivity Becomes Latest Addition to the Embedded Software Store

WATERLOO, Canada, March 18, 2013— RoweBots Research Inc., a leading supplier of tiny, embedded, Linux-compatible real-time operating system (RTOS) products, today announced the availability of…

March 20, 2013

Remcom Announces Breakthrough MPI + GPU Technology for High-Performance Simulation of Massive Electromagnetic Calculations In XFdtd

State College, PA (PRWEB) March 20, 2013 Remcom announces a breakthrough in current industry standards for electromagnetic simulation performance with MPI + GPU technology and…

March 20, 2013

New Ericsson power interface modules integrate digital communication abilities to simplify energy monitoring

New I2C- and PMBus-compliant Power Interface Modules optimized for AdvancedTCA Blade and embedded computing systems Integrated input-current monitoring negates need for additional components PIM delivers…

March 20, 2013

Tektronix Real-Time Oscilloscopes to Achieve 70 GHz Performance

BEAVERTON, Ore., March 19, 2013 – Tektronix, Inc., the world’s leading manufacturer of oscilloscopes, today announced that lab testing has shown that its next generation…

March 20, 2013

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