News – Page 1885 – EEJournal

Digi-Key Corporation and E Ink Sign Global Distribution Agreement

THIEF RIVER FALLS, Minnesota, USA – Global electronic components distributor Digi-Key Corporation, the industry leader in electronic component selection, availability and delivery, today announced a global distribution agreement…

March 12, 2013

TI introduces smart bypass diode with industry’s lowest power dissipation

DALLAS (Mar. 12, 2013) – Texas Instruments Incorporated (TI) (NASDAQ: TXN) today introduced a smart bypass diode in a standard surface-mount package with 15-A current…

March 12, 2013

FloorDirector 3.5 Provides Significant Dynamic Power Integrity Benefits at 28 nm

COPENHAGEN, Denmark, March 13th, 2013 – Teklatech®, an industry leader in EDA solutions for achieving dynamic power integrity and power noise closure in System-on-Chip (SoC) designs, today announced…

March 12, 2013

Cadence Acquires Tensilica

SAN JOSE, CA., 12 Mar 2013 HIGHLIGHTS: Tensilica® dataplane processing units (DPUs) combined with Cadence® Design IP will deliver more optimized IP solutions for mobile…

March 12, 2013

EV Group Extends Wafer Bonding Equipment and Process Solutions for Covalent Bonding Technology

ST. FLORIAN, Austria, March 5, 2013 – EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets,…

March 11, 2013

Renesas Electronics Expands the RX600 Microcontroller Series for Network, Industrial and Smart Metering Applications

Santa Clara, Calif., March 11, 2013 – Renesas Electronics Corporation (TSE: 6723), a premier provider of advanced semiconductor solutions, today announced the expansion of its 32-bit RX…

March 11, 2013

Smallest 14-Bit, 4.5Msps SAR ADC Integrates Precision Reference in 8mm² TSOT-23 Package

MILPITAS, CA – March 11, 2013 – Linear Technology Corporation introduces the LTC2314-14, a 14-bit 4.5Msps successive approximation register (SAR) ADC in a tiny 8-lead TSOT-23…

March 11, 2013

Green Hills Software Announces INTEGRITY Multivisor for Trusted Mobile Devices Version 4

Green Hills Software, the largest independent supplier of embedded and mobile virtualisation solutions, has announced a major new release of itsINTEGRITY® Multivisor™ for Trusted Mobile Devices.…

March 11, 2013

Xilinx Showcases 400G Applications for Optical and Wired OTN Markets at OFC 2013

Mar 11, 2013 – SAN JOSE, Calif., March 11, 2013 /PRNewswire/ — Xilinx, Inc. (NASDAQ: XLNX) will demonstrate 400G optical and wired OTN applications based on…

March 11, 2013

Aldec Releases Plot Window to Increase Productivity of Traditional Waveform-Based HDL Debugging

Henderson, NV – March 11, 2013 – Aldec, Inc. announces the latest release of its mixed-language advanced verification platform, Riviera-PRO™ 2013.02. This release includes numerous enhancements, including visual debugging tools…

March 11, 2013

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