News – Page 1905 – EEJournal

Inverting, Boost or Buck-Boost µModule Converter Delivers up to 700mA with Only Four Small Passive Components

MILPITAS, CA – February 5, 2013 – Linear Technology Corporation introduces the LTM8045, a 2.8V-18V input, multi-topology DC/DC µModule® (micromodule) converter, with onboard inductor, power switch and…

February 5, 2013

Cadence and GLOBALFOUNDRIES Collaborate to Enable Custom/Analog and Digital Design of 20nm Manufacturing Process

SAN JOSE, CA–(Marketwire – February 05, 2013) – Cadence Design Systems, Inc. (NASDAQ: CDNS), a leader in global electronic design innovation, announced today that GLOBALFOUNDRIES has…

February 5, 2013

SiTime Expands Portfolio with +125C MEMS Oscillators for Industrial and High Reliability Applications

SUNNYVALE, Calif. – January 23, 2013 – SiTime Corporation, the fastest growing semiconductor company, today introduced the SiT8920 MEMS oscillator for industrial and high reliability applications. Due to…

February 4, 2013

Cavium Announces Carrier Grade, Enterprise Quality, Commercial Software Development Environment for All OCTEON® Processors

SAN JOSE, Calif., Jan. 31, 2013 /PRNewswire/ — Cavium, Inc. (NASDAQ: CAVM), a leading provider of highly integrated semiconductor products that enable intelligent processing for networking,…

February 4, 2013

TU Dresden Realized 28nm Low Power Test Chip with Tensilica Processor and RacyICs Power Management in GLOBALFOUNDRIES Process

Dresden, GERMANY – February 4, 2013 –Technische Universität (TU) Dresden, a leading German university in the field of electrical engineering, today announced the successful initial…

February 4, 2013

Saelig Announces Sensor Solution to Monitor Driver Fatigue

Fairport, NY: Saelig Company, Inc. (www.saelig.com) has introduced a novel solution to monitor driver fatigue that is based on Plessey’s multi-award winning EPIC sensor technology. An…

February 4, 2013

Cadence to Present, Showcase Advanced FinFET Design Technology at Common Platform Technology Forum 2013

SANTA CLARA, CA–(Marketwire – February 04, 2013) – Cadence Design Systems, Inc. (NASDAQ: CDNS) WHAT: Cadence Design Systems, Inc. (NASDAQ: CDNS) Cadence will showcase its joint development of advanced…

February 4, 2013

Atmel Introduces New Family of Cortex-A5 Processor-Based MPUs For Embedded Industrial and Consumer Applications

SAN JOSE, CA, February 4, 2013—Atmel® Corporation (NASDAQ: ATML), a leader in microcontroller (MCU) and touch technology solutions, today announced it is shipping production quantities of the Atmel®…

February 4, 2013

Aldec Launches Free Online UVM Training

Henderson, NV – February 4, 2013 – Aldec, Inc., today announces the launch of Fast Track™ ONLINE, a convenient, online training portal that is available at no cost to…

February 4, 2013

TI power management front-end chip increases battery run-time in ARM® Cortex A15-based designs

DALLAS (Feb. 4, 2013) – Texas Instruments Incorporated (TI) (NASDAQ:TXN) today introduced the industry’s first single-chip, front-end power management unit (PMU) for battery-powered applications based on ARM Cortex…

February 4, 2013

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