News – Page 1914 – EEJournal

Common Embedded ARM Cortex™ A9 i.MX 6 Platform

Laguna Hills, California — January 15, 2013 — Cadia Networks, an innovative global supplier of application specific board level products and systems for a wide…

January 17, 2013

Avnet Embedded and Calxeda Showcase ARM-Based Solutions

SANTA CLARA, Calif.—January 16, 2013 — Avnet Embedded, a division of Avnet Electronics Marketing Americas, a business region of Avnet, Inc. (NYSE: AVT), and Calxeda today announced a joint…

January 17, 2013

PVA Tepla and imec Demonstrate 3D Through-Silicon via (TSV) Void Detection using GHz Scanning acoustic microscopy

Leuven (Belgium) – January 17, 2013 – Imec and PVA Tepla present breakthrough results in the detection of TSV voids in 3D stacked IC technology. After…

January 17, 2013

Tektronix Introduces New 32 Gb/s Multi-Channel Bit Error Rate Testers for 100G Network Design & Test

BEAVERTON, Ore., January 17, 2013 – Tektronix, Inc., a leading worldwide provider of test, measurement and monitoring instrumentation, today announced a new series of high-speed…

January 17, 2013

TI integrates USB on C2000™ Piccolo™ real-time, floating-point microcontrollers, enabling on-the-go field diagnostics and communications

Jan 17, 2013 – HOUSTON, Jan. 17, 2013 /PRNewswire/ — Helping customers develop end products requiring on-site connectivity, Texas Instruments Incorporated (TI) (NASDAQ: TXN) today…

January 17, 2013

STMicroelectronics balun device boosts performance and occupies 90% less board space in miniature Nordic-based sensor, tag, and ‘appcessory’ products

The BAL-NRF01D3 IPD balun device from STMicroelectronics converts the output of a Nordic nRF51 or nRF24 Series RF chip into the format required by an…

January 15, 2013

Archives: News

Common Embedded ARM Cortex™ A9 i.MX 6 Platform

Avnet Embedded and Calxeda Showcase ARM-Based Solutions

PVA Tepla and imec Demonstrate 3D Through-Silicon via (TSV) Void Detection using GHz Scanning acoustic microscopy

Tektronix Introduces New 32 Gb/s Multi-Channel Bit Error Rate Testers for 100G Network Design & Test

TI integrates USB on C2000™ Piccolo™ real-time, floating-point microcontrollers, enabling on-the-go field diagnostics and communications

Mouser Introduces Enhanced New RF Wireless Technology Site

Microsemi Expands Silicon Carbide (SiC) Power Module Product Family

Avnet Embedded Introduces Open Compute Project Innovation Labs

GUC Unveils The First IPD ASIC Service

STMicroelectronics balun device boosts performance and occupies 90% less board space in miniature Nordic-based sensor, tag, and ‘appcessory’ products