News – Page 1921 – EEJournal

Telit Wireless Solutions Strengthens its Presence in Smart-Metering Industry

Raleigh, N.C. – December 20, 2012 – Telit Wireless Solutions, a leading global vendor of high-quality machine-to-machine (M2M) modules and value-added services, today announced that its M2M modules have…

December 26, 2012

octoScope Introduces Industry’s First MIMO Wireless Channel Emulation Logic Subsystem

MARLBORO, MA –– December 20, 2012 –– octoScope, Inc., a wireless solutions and services company, today announced a real-time logic implementation of its multiple input multiple…

December 26, 2012

Agilent Technologies Selected by ST-Ericsson for RF and Digital Design Validation Solution Leadership

SANTA CLARA, Calif., Dec. 20, 2012 – Agilent Technologies Inc. (NYSE: A) announced today that ST-Ericsson selected Agilent’s solution for characterizing RF transceivers, a key component…

December 26, 2012

New Book Demystifies Black Art of Analog Design

WALTHAM, MA – December 17, 2012 – Newnes Press, an imprint of Elsevier, today announced the release of Analog Circuit Design, Volume 2, Immersion in the Black…

December 26, 2012

LDO from Diodes Incorporated Boosts Drive Capability

Plano, Texas – December 20th, 2012 –– Diodes Incorporated has introduced a pair of ultra low dropout (LDO) linear regulators, capable of delivering a continuous…

December 26, 2012

Digi-Key Corporation Announces Global Distribution Agreement with Cicoil

THIEF RIVER FALLS, Minnesota, USA – Global electronic components distributor Digi-Key Corporation, recognized by design engineers as having the industry’s largest selection of electronic components available for immediate shipment, today…

December 21, 2012

Mentor Graphics Announces Comprehensive Design Enablement Platform for Samsung’s 14nm IC Manufacturing Process

WILSONVILLE, Ore., December 21, 2012—Mentor Graphics Corp. (NASDAQ: MENT) today announced comprehensive design, manufacturing, and post tapeout enabling support for Samsung’s 14nm IC manufacturing processes,…

December 21, 2012

Demonstration of world’s first wearable 3D body motion tracking system based on consumer grade MEMS sensors at International CES

Enschede, the Netherlands – December 21th 2012 – Xsens, the leading innovator in 3D motion tracking technology and products, will demonstrate the world’s first wearable 3D body…

December 21, 2012

MEMS Is Changing The Game – Plus The Tablet, Handset And Future Of Consumer Electronics

PITTSBURGH—December 18, 2012—MEMS Industry Group (MIG), a global industry organization with close to 150 member-companies and partners, today announced a line-up of suppliers, partners and end-user…

December 21, 2012

Xilinx Vivado Design Suite Now Available in WebPACK Edition

SAN JOSE, Calif., Dec. 19, 2012 /PRNewswire/ — Xilinx, Inc. (NASDAQ: XLNX) today announced its Vivado™ Design Suite is now available in WebPACK Edition, giving designers immediate access to a no cost,…

December 21, 2012

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