News – Page 1924 – EEJournal

Cypress’s 2.4-GHz WirelessUSB™-NL Radio-on-a-Chip Powers ITON’s Turnkey Module for Wireless Mice

SAN JOSE, Calif., December 13, 2012 – Cypress Semiconductor Corp. (Nasdaq: CY) today announced that ITON Technology, Ltd., a leading PC peripheral and component manufacturer in China, has selected Cypress’s 2.4-GHz WirelessUSB™-NL radio-on-a-chip…

December 17, 2012

Lattice Semiconductor Will Feature Real-Time 3D Video Converter AT CES 2013

HILLSBORO, OR – DECEMBER 17, 2012 – Lattice Semiconductor Corporation (NASDAQ: LSCC) today announced it will demonstrate 3D Impact Media’s RealityBox, a low density LatticeECP3™ FPGA-based real-time 3D video…

December 17, 2012

STMicroelectronics selects IAR Embedded Workbench for record-breaking code speed

Uppsala, Sweden—December 17, 2012—IAR Systems® today announces that its development tool suite IAR Embedded Workbench® for ARM® has been selected by STMicroelectronics for its recently…

December 17, 2012

Elliptic Technologies Selects Synopsys’ Discovery VIP for ARM AMBA Interconnect for Verification of its Leading Security Systems

MOUNTAIN VIEW, Calif., Dec. 17, 2012 /PRNewswire/ — Synopsys, Inc. (NASDAQ: SNPS), a global leader providing software, IP and services used to accelerate innovation in chips…

December 17, 2012

QuickLogic Showcases Broad Range of CSSP Solutions for Mobile Devices at CES

Sunnyvale, CA – December 13, 2012 — QuickLogic Corporation (NASDAQ: QUIK), the leader in low-power Customer Specific Standard Products (CSSPs), is demonstrating a broad range of…

December 13, 2012

Arasan Chip Systems further expands its Ethernet portfolio by adding AVB (Audio Video Bridging)

San Jose, California – December 10, 2012 -Arasan Chip Systems, Inc. (“Arasan”), a leading provider of Total IP Solutions, announced today that they have added AVB…

December 13, 2012

WiFi Front End Modules

RFMD’s new RFFM8xxx series provide complete integrated solutions in single front end modules (FEMs) for WiFi systems. The ultra-small form factor and integrated matching minimizes…

December 13, 2012

Imec Shows Path Toward Non-Si Devices at IEDM 2012

IEDM2012, San Francisco, USA – December 12, 2012 – At this week’s IEEE International Electron Devices Meeting (IEDM 2012), imec addressed key challenges of scaling beyond silicon-channel…

December 13, 2012

DC/DC Converter from Diodes Incorporated Boosts Light Load Efficiency

Plano, Texas – December 13th, 2012 – Designed to help meet energy efficiency standards under light load and standby conditions, the AP65200 synchronous DC-DC buck…

December 13, 2012

Nordic nRF8001-powered module from LiSeng makes bridging the gap between healthcare products and smartphones simple

Oslo, Norway – December 13, 2012 – Ultra low power (ULP) RF specialist Nordic Semiconductor ASA (OSE: NOD) today announces that Hong Kong-headquartered ODM LiSeng…

December 13, 2012

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