Archives: News
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NANIUM Extends Wafer-Level Packaging (WLP) Offer by Including Fan-In WLP Volume Production On 300mm Wafers
PORTO, Portugal – Nov. 7, 2012 – NANIUM, a leading provider of semiconductor packaging, test and engineering services, today announced that it has extended its offering to…
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Mentor Graphics New Tessent IJTAG Product Automates IP Test and Debug Integration in Large SoC Designs
WILSONVILLE, Ore., November 6, 2012-Mentor Graphics Corporation (NASDAQ:MENT) today announced its new TessentR IJTAG solution, which allows designers to easily reuse test, monitoring and debugging logic…
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Aldec Boosts VHDL Simulation Performance
Henderson, NV – November 5, 2012 – Aldec, Inc. announced the release of its mixed language advanced verification platform,Riviera-PRO™ 2012.10. The release delivers numerous stability and performance improvements,…
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Agilent Technologies Introduces Electrical Redriver Modeling Solution to Solve Key Challenges in Designing Chip-to-Chip Links
SANTA CLARA, Calif., Nov. 5, 2012 – Agilent Technologies Inc. (NYSE:A) today introduced a redriver modeling solution designed to quickly and accurately solve the challenge posed…
