Archives: News
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Unleash Parallel Power with ASRock Industrial’s IMB-X1900, Driven by Intel® Xeon® W Performance
Taipei, Taiwan (September 18, 2024) – In today’s fast-paced business environment, efficiency and performance are paramount. ASRock Industrial introduces the IMB-X1900, a motherboard that combines…
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HSYCO Gateway Simplifies Communication Between Disparate, Proprietary Industrial and Building Automation Protocols
18/9/2024 HSYCO, a leader in building and industrial automation supervision systems, has announced a platform to simplify communication between the array of disparate proprietary connectivity…
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NXP’s MC33777 Revolutionizes Battery Pack Monitoring Technology for Electric Vehicles
What’s new: NXP® Semiconductors today announced the MC33777, the world’s first battery junction box IC that integrates critical pack-level functions into a single device. Unlike conventional…
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Infineon and Oxford Ionics awarded contract to build a mobile quantum computer
Munich – 18 September 2024 – Infineon Technologies AG and its technology partner Oxford Ionics Ltd. have been selected to build a mobile quantum computer…
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TeraSignal Introduces TSLink: Protocol-Agnostic Intelligent Interconnect for Plug-and-Play Linear Optics in AI Infrastructure
IRVINE, Calif., Sept. 17, 2024 – ECOC 2024 – TeraSignal, a leader in intelligent interconnect technology, today introduced TSLink, the world’s first intelligent chip-to-module (C2M) interconnect designed…