Archives: News
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LDRA Joins The Open Group SOSA Consortium
WIRRAL, UK – September 17, 2024 – LDRA today announced it has joined The Open Group Sensor Open Systems Architecture (SOSA™) Consortium, a vendor- and platform-agnostic forum for industry and…
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Cadence Tensilica HiFi 5 DSPs Used in NXP’s Next-Gen Audio DSP Family
In a significant achievement for the automotive industry, Cadence’s Tensilica HiFi 5 Digital Signal Processors (DSPs) are now a key component in NXP® Semiconductors’ latest…
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STMicroelectronics unveils new generation of silicon carbide power technology tailored for next-generation EV traction inverters
Smaller, more efficient products to ramp-up in volumes through 2025 across 750V and 1200V classes, will bring the advantages of silicon carbide beyond premium models…
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VIAVI Drives Down Testing Complexity and Cost with Automation and Orchestration Platform
Chandler, Ariz., September 12, 2024 – VIAVI Solutions Inc. (VIAVI) (NASDAQ: VIAV) today introduced the VIAVI Automation Management and Orchestration System (VAMOS), an intelligent automation platform that…
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Infineon pioneers world’s first 300 mm power gallium nitride (GaN) technology – an industry game-changer
Infineon will shape the rapidly growing GaN market with this groundbreaking GaN 300 mm technology Infineon leverages existing large scale 300 mm silicon manufacturing to…