Archives: News
-
Agilent Technologies Announces Industry’s Most Cost-Effective PCI Express® 3.0 Flying Lead Probe
SANTA CLARA, Calif., April 5, 2012 – Agilent Technologies Inc. (NYSE: A) today announced a new flying lead solder-down probe for PCI Express 3.0 protocol analysis. The…
-
Oasys Design Systems Closes Series B Funding With Investments From Intel Capital, Xilinx
SANTA CLARA, CALIF. –– April 10, 2012 — Oasys Design Systems, a provider of chip design software, today announced it has closed Series B Funding with investments from Intel Capital, Intel’s global investment organization, and Xilinx, a leading…
-
Imec’s resistive RAM research shows momentum in 2012 VLSI Technology Symposium papers
Leuven (Belgium) – April 10, 2012 – At this year’s Symposia on VLSI Technology and VLSI Circuits (June 12-15, 2012 – Honolulu, USA,), imec and…
-
Cadence Low-Power, Advanced-Node Digital Technology Incorporated Into SMIC 40nm Reference Flow
SAN JOSE, CA–(Marketwire – April 10, 2012) – The SMIC-Cadence flow automates designs with advanced power management features. This production-proven methodology is fully incorporated across the…
-
Zuken Joins ODB++ Solutions Alliance
3, April 2012 – Munich, Germany and Westford, MA, USA – Zuken has extended its OpenDoor agreement with Mentor Graphics by participating as a partner…