Archives: News
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Altium and FTDI Chip collaborate on new board-level components
February 7th 2012 – Altium, developer of next-generation electronics design software and services, has announced the full range of board-level IC component solutions from Future Technology Devices…
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IEDEC Announces Program, Focus on Excellence in Interdisciplinary Engineering Education
SANTA CLARA, Calif. –2 February, 2012 – The Interdisciplinary Engineering Design Education Conference (IEDEC) announced its 2012 program consisting of talks by experts from industry and academia that cover critical issues…
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New Picor Hot Swap Controller Ensures Safe, Continuous System Operation with Advanced Digital Thermal Emulation
APEC 2012 – Orlando, FL – February 6, 2012 – Vicor Corporation (NASDAQ: VICR), today unveiled its new Picor Cool-Swap™ PI2211 hot swap controller and…
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Agilent Technologies Announces Industry’s First Eight-Channel RF Measurement Solution Addressing LTE and Beamforming
SANTA CLARA, Calif., Feb. 2, 2012 – Agilent Technologies Inc. (NYSE: A) today introduced industry-leading enhancements to its N7109A multi-channel signal analyzer for emerging multichannel LTE, LTE-Advanced and MIMO RF…
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Cadence Collaborates With Samsung Foundry to Deliver Design-for-Manufacturing Solution for 32-, 28- and 20-Nanometer Chip Design
SAN JOSE, CA — (Marketwire – February 06, 2012) – The unique Cadence in-design approach to Silicon Realization moves traditional DFM steps into the implementation stage…