Archives: News
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Cadence Publishes Definitive Book on Advanced Verification for Today’s ICs
SAN JOSE, CA–(Marketwire – January 17, 2012) – “With the march toward greater design complexity showing no sign of abating, comprehensive verification is essential for a…
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MoSys, Inc. Earns ISO 9001:2008 Certification
SANTA CLARA, Calif., January 17, 2011 – MoSys (NASDAQ: MOSY), a provider of serial chip-to-chip communications solutions that deliver unparalleled bandwidth performance for next generation networking systems and…
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Baolab announces evaluation kits for its award winning NanoEMS MEMS – available to customers
Barcelona, Spain – 16 January 2012. Baolab Microsystems has announced that it will have evaluation kits of its recently announced 3D NanoCompass™ available at the…
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Kistler Introduces Miniature PiezoBeam® TEDS Accelerometers for Multi-Channel Modal Testing
January 15, 2012, Novi, Michigan, USA – Kistler North America (www.kistler.com), a worldwide supplier of precision sensors, systems and instrumentation for the dynamic measurement of pressure,…
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2E mechatronic Uses Ticona Vectra® E840i LDS to Develop 3-D Chip Carrier Produced Via Laser Direct Structuring
Florence, Ky., Sulzbach, Germany, Shanghai, PR China, Jan. 12, 2012 – 2E mechatronic GmbH & Co. KG of Germany has designed a 3-D molded interconnect device…