Archives: News
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KLA-Tencor Introduces Additions To Sensarray™ Portfolio Of Semiconductor In-Situ Process Monitoring Solutions
MILPITAS, Calif., December 5, 2011—KLA-Tencor Corporation (NASDAQ: KLAC), the world’s leading supplier of process control and yield management solutions for the semiconductor and related industries, today…
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Cymer Reduces Chipmakers’ Operating Costs With the Next Generation Gas Lifetime eXtension – iGLX™
SAN DIEGO, Nov. 28, 2011 /PRNewswire/ — Cymer, Inc. (Nasdaq: CYMI), the world’s leading supplier of light sources used by chipmakers to pattern advanced semiconductor chips, today announced its third-generation…
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Thinfilm and Polyera Partner to Bring Printed CMOS Memory to Market
OSLO, November 30 – Thin Film Electronics ASA (“Thinfilm”) today announced a partnership with Polyera – a developer and supplier of high-performance functional materials for the flexible and printed electronics industry. Thinfilm…
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Magma’s Latest Version of FineSim Pro Delivers 3X Faster Runtime, Allowing SPICE-Accurate Simulation of Very Large Analog/Mixed-Signal Designs
SAN JOSE, Calif., Nov. 30, 2011 – Magma Design Automation Inc. (Nasdaq: LAVA), a provider of chip design software, today announced the availability of a new…
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Amplicon launch new division – Engineering Services
Brighton, UK, 30th November 2011 – Amplicon has announced the introduction of a new division, Engineering Services. This new venture, as well as creating new employment opportunities,…
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SpringSoft Targets Chip Finishing Applications With New Laker Blitz
HSINCHU, Taiwan, November 29, 2011 – SpringSoft, Inc., a global supplier of specialized IC design software, today announced immediate availability of the Laker Blitz chip-level layout editor,…
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Interdigitated back-contact silicon solar cells above 23% efficiency
Leuven, Belgium – December 1, 2011 – Imec together with its silicon photovoltaic industrial affiliation program partners Schott Solar, Total, Photovoltech, GDF-SUEZ, Solland Solar, Kaneka and Dow…