News – Page 2140 – EEJournal

COM Express Type 6 module from congatec with Intel® Quad-Core processor

Nuremberg, SPS/IPC/Drives, 22 November 2011 * * * congatec AG has unveiled the conga-TM67, a new high-performance module for future designs. The Type 6 Pin-out and…

November 22, 2011

KEMET Offers HiQ-CBR Series Surface Mount Multilayer Ceramic Capacitors for Radio Frequency and Microwave Applications

KEMET has introduced its new HiQ-CBR Series Surface Mount Multilayer Ceramic Capacitors (MLCCs) in C0G dielectric. The HiQ-CBR Series features a robust and exceptionally stable…

November 22, 2011

Lattice Releases Sercos III Real-Time Industrial Ethernet Solution

HILLSBORO, OR – NOVEMBER 22, 2011 – Lattice Semiconductor Corporation (NASDAQ: LSCC) today announced the immediate availability of a Sercos III real-time Ethernet solution. The low cost, low power LatticeECP3™…

November 22, 2011

congatec unveils Qseven mini carrier baseboard for accelerated design-in

Nuremberg, SPS/IPC/Drives, 22 November 2011 * * * congatec AG, a leading manufacturer of embedded computer modules,presents the conga-QMCB, a new mini carrier baseboard for space-critical…

November 22, 2011

Renesas Electronics Europe and Hilscher GmbH Cooperate on Development of a New 40-nm High-End ARM™-Based System-on-Chip (SoC) for Industrial Automation Systems

Dusseldorf, Hattersheim, Germany, November 22, 2011 – Renesas Electronics Europe, a premier provider of advanced semiconductor solutions, and Hilscher GmbH, a leading supplier of industrial communication systems and…

November 22, 2011

TI Sitara™ AM335x ARM® Cortex™-A8 microprocessors: First single-chip solutions offering integrated industrial communication protocols to accelerate industrial designs

Multiple, on-chip, production-ready, industrial Ethernet and fieldbus communication protocols eliminate the need for an external ASIC/FPGA and save 30 percent on BOM costs One scalable, low-power…

November 22, 2011

DiSTI Unveils New GL Studio Package with Limited Time Offer

Orlando, FL (November 21, 2011) – The DiSTI Corporation, a leading provider of advanced graphical interface technology, launched a new package of its award-winning GL Studio…

November 22, 2011

Renesas Electronics Europe and Technologie Management Gruppe GmbH Announce Availability of a Remote-IO Toolbox for IO-Link, PROFINET and Ethernet/IP

Düsseldorf, Karlsruhe, Germany, November 22, 2011 – Renesas Electronics Europe, a premier provider of advanced semiconductor solutions, and TMG Technologie und Engineering GmbH today announced the availability…

November 22, 2011

IAR Systems delivers complete starter kit for high-performance STM32F407ZG microcontroller

Uppsala, Sweden—November 22, 2011—IAR Systems® today announces a new 32-bit kit for STMicroelectronics’ first ARM Cortex-M4 based microcontroller series—STM32 F4. IAR KickStart Kit™ for STM32F407ZG…

November 22, 2011

ABS GmbH Selects The LatticeECP3 FPGA Family For CCD Interface And Processing

HILLSBORO, OR – NOVEMBER 21, 2011- Lattice Semiconductor Corporation (NASDAQ: LSCC) today announced that ABS GmbH, Jena, Germany, has chosen the mid-range LatticeECP3™ FPGA for use in its…

November 21, 2011

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