Archives: News
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Lamachan2 Extreme I/O Solution
Using a Xilinx™ Spartan™-6 FPGA to support a high performance PCI Express interface and large I/O count Lamachan2 offers an extreme I/O solution for High Performance Computing…
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Cadence Wins TSMC EDA Partner Award for 3D-IC Technology
SAN JOSE, CA–(Marketwire – November 14, 2011) – Cadence was cited for helping implement an interposer test vehicle using Cadence standard 3D-IC solutions that employed through-silicon…
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Adapteva Uses Magma’s RTL-to-GDSII Flow to Tape Out a 28-nm 64-Core Microprocessor Chip
SAN JOSE, Calif., Nov. 10, 2011 – Magma Design Automation Inc. (Nasdaq: LAVA), a provider of chip design software, today announced that Adapteva used Magma software…
