Archives: News
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Alchimer Discloses Major TSV Barrier Film Advance; 100 Percent Step Coverage Boosts Fill Speed and Quality
TAIPEI, Taiwan – A new film-deposition technology advance from Alchimer S.A. promises to cut fill deposition times and provide new options for the electronics packaging…
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EDA Industry to Recognize Dr. C. L. David Liu with Phil Kaufman Award
SAN JOSE, Calif. and NEW YORK — September 13, 2011 — Dr. C. L. David Liu, the William Mong honorary chair professor of Computer Science and…
