Archives: News
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Accellera Announces Formation of the Federated Simulation Standard Working Group
Elk Grove, Calif., June 24, 2024 — Accellera Systems Initiative (Accellera), the electronics industry organization focused on the creation and adoption of electronic design automation…
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Cirrus Logic Unveils Its Latest Additions to its Family of Professional Audio Converters
June 25, 2024 – Cirrus Logic (Nasdaq: CRUS) today unveiled the latest devices in its Pro Audio product family: a series of digital-to-analog converters (DACs)…
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Early Access to MPLAB® Extensions for VS Code® Provides Designers with the Ability to Utilize Microchip’s Development Tools Inside of the Popular IDE
CHANDLER, Ariz., June 25, 2024 —Leveraging the versatility of Microsoft® Visual Studio® Code (VS Code®), Microchip Technology (Nasdaq: MCHP) has released an early access version of MPLAB®…
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Xpeedic Releases EDA 2024 Platforms to Accelerate Designs, Simulations of Next-Generation High-Frequency, High-Speed Electronic Products
Upgrades solver engines, new features across all fields in advanced packaging, high-speed system, RF system and multi-physics simulation Will demonstrate entire EDA 2024 platform at…
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Memfault Unveils “Product Analytics” to Provide Deep Insight into IoT Device User Behavior and Product Performance
SAN FRANCISCO, CA – June 25, 2024 – Memfault, provider of the first embedded device observability platform, today announced the launch of Product Analytics, a powerful…
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Solidion Ready to Expand Production Capacity of Silicon/Graphene Composite Anode Materials
DAYTON, Ohio, June 25, 2024 (GLOBE NEWSWIRE) — Solidion Technology, Inc. (NASDAQ ticker symbol “STI”), an advanced battery technology solutions provider, today announced its plan…
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Industry-first embedded SIM from STMicroelectronics supports new standard expected to revolutionize bulk IoT device management
Geneva, Switzerland, June 19, 2024 – STMicroelectronics has introduced the ST4SIM-300, the first embedded SIM in the industry to meet the incoming GSMA standard for…
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CEA-Leti Announces Launch of FAMES Pilot Line As Part of EU Chips Act Initiative
GRENOBLE, France – June 24, 2024 – CEA-Leti is proud to announce the kick-off meeting today of the FAMES Pilot Line, a pioneering project aimed at advancing…