Archives: News
-
IMAPS Academy Online Portal Launched to Support Semiconductor Advanced Packaging Workforce Development
PITTSBURGH, May 30, 2024 (GLOBE NEWSWIRE) — The International Microelectronics Assembly and Packaging Society (IMAPS), the largest organization dedicated to the advancement and growth of…
-
RoboSense Launches New Mid-Long Range MX LiDAR, Leading the Industry into the “Mass Adoption” Era
Detroit, MI. — RoboSense (2498.HK), the global leader in LiDAR and perception solution market, held the “REDEFINED” 2024 new product launch event, and unveiled the…
-
TDK launches environmentally sustainable radio wave absorbers using biomass material
Officially approved by the Japan BioPlastics Association (JBPA) By including more than 25 wt% of biomass material, it enables a reduction of COâ‚‚ emissions by…
-
Cinch Connectivity Launches QPS Terminations for Deep Space Exploration
Lombard, IL [May 29, 2024] – Cinch Connectivity Solutions, a Bel Fuse company, (NASDAQ: BELFA and BELFB) and global leader in delivering reliable connectivity solutions,…
-
Aitech Announces 10/40GbE Fully Managed Ethernet Switch/Router on XMC Form Factor
M622 Highlights: Enables high-speed onboard Ethernet-based digital backbone and network infrastructure Small form factor XMC reduces the number of slots required and significantly optimizes SWaP-C…
-
Vishay Intertechnology Adds Pick and Place Friendly SMD Lead Bending Option for AC05 and AC05-AT 5 W Cemented, Axial-Leaded Wirewound Resistors
MALVERN, Pa. — May 29, 2024 — Vishay Intertechnology, Inc. (NYSE: VSH) today announced that 5 W devices in its AC and AC-AT series of cemented, axial-leaded wirewound…
-
SynaXG and Singapore University of Technology and Design (SUTD) Collaborate to Advance O-RAN and AI Research
SINGAPORE, May 27, 2024 – SynaXG, a leading provider of converged AI+5G and O-RAN network solutions, today announced a strategic partnership with the Singapore University of Technology and Design…