Archives: News
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Infineon presents XENSIV™ TLE49SR angle sensor family with outstanding stray field robustness
Munich, Germany – 15 May 2024 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) introduces the new XENSIV™ TLE49SR angle sensor family, which combines…
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Rohde & Schwarz introduces the MXO 5C series, the world’s most compact oscilloscope with up to 2 GHz bandwidth
Rohde & Schwarz extends its portfolio with a 2U high oscilloscope/digitizer tailored for rack mount and other applications where a low-profile form factor is critical.…
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SEMICON West 2024 to Spotlight U.S. Chip Industry Investments, Supply Chain Resilience, Talent, and Global Growth and Innovation
MILPITAS, Calif. – May 15, 2024 – SEMICON West 2024 will gather industry experts and leaders July 11-13 at the Moscone Center in San Francisco for insights…
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The Open 6G OTIC at Northeastern University Announces General Availability of Open RAN Testing and Integration Solutions
BOSTON, May 14, 2024 – The Open6G Open Testing and Integration Center (OTIC) at the Institute for the Wireless Internet of Things (WIoT) at Northeastern University announces the general…
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Digital Core Design in cooperation with DCD-SEMI Unveils DCAN-XL: Revolutionary CAN XL IP Core Bridging the Gap Between CAN FD and Ethernet
[Bytom, May the 14th 2024] — Digital Core Design (DCD), a pioneer in semiconductor IP cores, proudly announces the launch of its latest innovation, the…
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Design 1st and Swabbot Elevate Industrial Cleaning with Collaborative Robot Solution Engineered for Precision, Safety, and Efficiency
OTTAWA, May 14, 2024 (GLOBE NEWSWIRE) — Design 1st, one of the most prolific full-service product design-engineering firms across North America, in partnership with Swabbot, announced today…
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Vishay Intertechnology 600 V E Series Power MOSFET in Compact Top-Side Cooling PowerPAK® 8 x 8LR Delivers Industry’s Lowest RDS(ON)*Qg FOM
MALVERN, Pa. — May 1, 2024 — To provide higher efficiency and power density for telecom, industrial, and computing applications, Vishay Intertechnology, Inc. (NYSE: VSH) today…
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eXtremeDB 8.4 Unveils Exciting New Features and Enhancements
May 14, 2024, Seattle, WA USA — McObject®, a leading provider of embedded database management systems, is thrilled to announce the release of eXtremeDB 8.4.…
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Floating board-to-board connectors
Middletown, Pa. – The space-saving board-to-board connectors in Phoenix Contact’s FS 0.635 series enable mezzanine PCB arrangements with high-speed data transmission rates up to 30 Gbps.…