News – Page 272 – EEJournal

Microchip Launches dsPIC® DSC-Based Integrated Motor Drivers that Bring Controllers, Gate Drivers and Communications to a Single Device

CHANDLER, Ariz., February 26, 2024 — To implement efficient, real-time embedded motor control systems in space-constrained applications, Microchip Technology (Nasdaq: MCHP) has launched a family of dsPIC® Digital Signal…

February 26, 2024

Infineon unveils high density power modules to enable benchmark performance and TCO for AI data centers

Munich, Germany, Long Beach, California – 26 February 2024 – Artificial Intelligence is currently driving an exponential increase in global data generation, and consequently increasing…

February 26, 2024

Innoscience launches 700V integrated GaN HEMT IC family, saving component count, board space and design complexity

February 26, 2024 – Innoscience the company founded to create a global energy ecosystem based on high-performance, low-cost, gallium-nitride-on-silicon (GaN-on-Si) power solutions, today announced a family of…

February 26, 2024

Siemens collaborates with Intel Foundry to contribute 3D-IC technology leadership for Intel’s EMIB reference flow

Siemens Digital Industries Software today announced it has collaborated with Intel Foundry to develop a comprehensive workflow for the foundry’s embedded multi-die interconnect bridge (EMIB)…

February 23, 2024

Get Your Hands on the New Raspberry Pi 5 – Now in Stock at Newark

Chicago – February 21, 2024: The all-new Raspberry Pi 5 4GB and 8GB boards are now available to order for next-day delivery from Newark, Raspberry Pi’s…

February 23, 2024

Cadence and Intel Foundry Collaborate to Enable Heterogeneous Integration with EMIB Packaging Technology

Cadence and Intel Foundry have collaborated to develop and certify an integrated advanced packaging flow utilizing Embedded Multi-die Interconnect Bridge (EMIB) technology to address the…

February 23, 2024

Renesas Develops Embedded MRAM Macro that Achieves over 200MHz Fast Random-Read Access and a 10.4 MB/s Fast Write Throughput for High Performance MCUs

TOKYO, Japan, February 21, 2024 ― Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today announced that it has developed circuit technologies for…

February 23, 2024

u-blox releases versatile Wi-Fi 6 module for the mass market

Thalwil, Switzerland – February 22, 2024 – u-blox (SIX:UBXN), a global provider of leading positioning and wireless communication technologies and services, has announced its new NORA-W4 module. With its comprehensive range of…

February 23, 2024

STMicroelectronics expands into 3D depth sensing with latest time-of-flight sensors

STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, announced an all-in-one, direct Time-of-Flight (dToF) 3D LiDAR (Light Detection…

February 23, 2024

Bourns Unveils Shielded Power Inductor Series Designed with a Ferrite Core and Ferrite Shield for Low Magnetic Field Radiation

RIVERSIDE, Calif., February 20, 2024 – Bourns, Inc., a leading manufacturer and supplier of electronic components for power, protection, and sensing solutions, today announced its…

February 23, 2024

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