News – Page 279 – EEJournal

DISCOVER-US initiates new era in EU-US edge AI research

Launched on 1 January 2024, the DISCOVER-US project will promote the creation of new research alliances in distributed computing and swarm intelligence between researchers in…

February 6, 2024

TE Connectivity launches VITA 87 High Density Circular MT Connectors

HARRISBURG, Pa. – Feb 07, 2024 – TE Connectivity (TE), a world leader in connectivity and sensors, continues to be at the vanguard of the industry with the…

February 6, 2024

element14 Community Launches “Experimenting with Extreme Environments” Design Challenge

Chicago – February 6, 2024: element14, an Avnet Community, in collaboration with Hammond Manufacturing, is launching the “Experimenting with Extreme Environments” Design Challenge. Ten experimenters will have…

February 6, 2024

Newark incorporates new, industry leading resistors from KOA Corp. into portfolio

Chicago – February 1, 2024: Newark is now stocking a range of special flat chip resistor solutions from KOA Corporation (KOA). Important to design engineers in a…

February 5, 2024

Alchip Technologies Demonstrates IC Ecosystem at Chiplet Summit

Santa Clara, CA, February 2, 2024 – Ecosystem collaboration will be the key strategy to overcome the functional scaling, time-to-market, and economic challenges of heterogeneous…

February 5, 2024

New eBook from Mouser and Würth Elektronik Offers Expert Perspectives on Internet of Things

February 1, 2024 – Mouser Electronics, Inc., the authorized global distributor with the newest electronic components and industrial automation products, has released a new eBook in collaboration with Würth Elektronik,…

February 5, 2024

NECTO Studio 6.0 enables developers to bring circuits to life

February 2024: MikroElektronika (MIKROE), the embedded solutions company that dramatically cuts development time by providing innovative hardware and software products based on proven standards, has unveiled v6.0…

February 5, 2024

e-con Systems™ launches 20MP High Resolution Multi-Camera for NVIDIA Jetson Orin; Redefining Imaging Quality

California & Chennai (Jan 18, 2024): e-con Systems™, with over two decades of experience in designing, developing, and manufacturing OEM cameras, has launched e-CAM200_CUOAGX –…

February 2, 2024

Cadence Unveils Millennium Platform—Industry’s First Accelerated Digital Twin Delivering Unprecedented Performance and Energy Efficiency

Highlights: Revolutionary dedicated HW/SW acceleration platform leverages GPU and CPU computing and proprietary software algorithms to deliver up to 100X design impact through accuracy, speed and…

February 2, 2024

Infineon and Honda enter strategic collaboration and sign MoU to collaborate on automotive semiconductor solutions

Munich, Germany and Tokyo, Japan – 1 February 2024 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) today announced that Infineon and Honda Motor Co.,…

February 2, 2024

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