Archives: News
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Nexperia now offers GaN FETs in compact SMD packaging CCPAK for industrial and renewable energy applications
Nijmegen, December 11, 2023: Nexperia today announced that its GaN FET devices, featuring next-gen high-voltage GaN HEMT technology in proprietary copper-clip CCPAK surface mount packaging, are now…
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SEMI Applauds Advancement of U.S. CHIPS and Science Act Incentives
MILPITAS, Calif. – December 11, 2023 – SEMI, the industry association serving the global electronics design and manufacturing supply chain, today applauded the first award of U.S. CHIPS…
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Imec Presents Fundamentally New Way to Render Colors with Sub-micron Pixel Sizes that Revolutionizes Camera Performance
LEUVEN (Belgium), DECEMBER 11, 2023— This week at the 2023 International Electron Devices Meeting (IEEE IEDM 2023), imec, a world-leading research and innovation hub in…
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Mercury Introduces First Commercial Air-to-Ground SAR Radar Flight Testing Simulator
ANDOVER, Mass., Dec. 11, 2023 (GLOBE NEWSWIRE) — Mercury Systems, Inc. (NASDAQ: MRCY, www.mrcy.com), a technology company that delivers mission-critical processing power to the edge, today…
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Innoscience launches low voltage HEMT family in easy-to-use flip chip QFN packaging
11th December 2023 – Innoscience Technology, the company founded to create a global energy ecosystem based on high-performance, low-cost, gallium-nitride-on-silicon (GaN-on-Si) power solutions, has announced a new…
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Continental and Synopsys Provide Vehicle Digital Twin Capabilities to Accelerate Software Development
Integration of Synopsys virtual electronic control unit (vECU) solutions with Continental’s cloud-based development environment (CAEdge) enables faster advancement for the Software-Defined Vehicle (SDV) Synopsys virtual…