Archives: News
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Cadence Expands Support for 3Dblox 2.0 Standard with New System Prototyping Flows
Cadence Integrity 3D-IC Platform fully supports latest 3Dblox 2.0 standard across all TSMC’s 3DFabric offerings Integrity 3D-IC Platform uniquely combines system planning, implementation and system-level…
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Synopsys and TSMC Streamline Multi-Die System Complexity with Unified Exploration-to-Signoff Platform and Proven UCIe IP on TSMC N3E Process
Highlights: Synopsys 3DIC Compiler integrates with 3Dblox 2.0 standard for heterogeneous integration and a complete exploration-to-signoff solution. Synopsys UCIe PHY IP, which achieved first-pass silicon…
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Percepio® Enables Trace Observability for All RTOS, Middleware and Silicon Vendor APIs
Västerås, Sweden, September 27, 2023 * * * Percepio AB, the leading provider of edge observability solutions for system developers within critical Operational Technology (OT) applications, announces…
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Siemens and TSMC collaborate to help mutual customers optimize designs using foundry’s newest advancements
Siemens Digital Industries Software today announced new certifications and collaborations with longtime partner TSMC, resulting in the successful qualification of multiple industry-leading Siemens EDA product…