Archives: News
-
TE Connectivity to host Single Pair Ethernet fundamentals course
SCHAFFHAUSEN, Switzerland – Sept. 25, 2023 – TE Connectivity (TE), a world leader in connectivity and sensors, has partnered with RealPars, the world’s largest online learning platform for cutting-edge…
-
VVDN Technologies and Axiado Collaborate on Open Compute Platform Compliant Data Center and Telco O-RAN Servers
GURGAN, India and SAN JOSE, Calif., September 25, 2023 — 2023 OCP Global Summit — VVDN Technologies, a global provider of product engineering, manufacturing and digital services and solutions,…
-
Purdue’s semiconductor innovation ecosystem grows with CHIPS-funded, Indiana-led semiconductor hub and with upcoming summit
WEST LAFAYETTE, Ind. – Purdue University continues building momentum as America’s leading university in semiconductors, with a broad range of updates this fall semester. CHIPS…
-
Saelig Announces Demo Boards For Novel Patented Pulsiv OSMIUM Power Electronics Technology Which Minimizes Energy Waste
Fairport NY: Saelig Company, Inc. has announced the availability of the Pulsiv PSV-AD-250-DS Evaluation Boards for the OSMIUM Microcontroller family, which enables rapid customer evaluation of the ultra-efficient Pulsiv power supply technology. The Pulsiv…
-
Baker Hughes Launches New Druck Hydrogen Pressure Sensor Technology
HOUSTON and LONDON – Sept. 22, 2023 –Baker Hughes, an energy technology company, has announced the launch of its latest product for hydrogen – Druck hydrogen-rated pressure…
-
Purdue center addresses pressing challenge of securing semiconductor chips
WEST LAFAYETTE, Ind. – Purdue University’s emergence as a leader in semiconductor chips also requires it to usher in a new level of security that…
