News – Page 336 – EEJournal

Autonomous and fully connected, software-defined vehicles are the future of the automotive industry and a new alliance on a standardized high-performance data transmission system makes them a reality

WINSTON-SALEM, N.C. – Sept.18, 2023 – Automobile manufacturers are eager for standards-based advanced connectivity solutions for the development of the latest generation of autonomous, connected,…

September 18, 2023

Synopsys Demonstrates Industry’s First Interoperability of PCI Express 6.0 IP with Intel’s PCIe 6.0 Test Chip

SUNNYVALE, Calif., September 18, 2023 /PRNewswire/ – Synopsys, Inc. (Nasdaq: SNPS) today announced that its collaboration with Intel has achieved end-to-end 64 GT/s interoperability between Synopsys’ IP for PCI Express…

September 18, 2023

Nanusens technology is key to enabling AI to be smarter

The problem at the moment is that sensors are currently manufactured on a tiny sliver of silicon, or die, by a small number of specialist…

September 16, 2023

Cadence Accelerates On-Device and Edge AI Performance and Efficiency with New Neo NPU IP and NeuroWeave SDK for Silicon Design

Neo NPUs efficiently offload from any host processor and scale from 8 GOPS to 80 TOPS in a single core, extending to hundreds of TOPS for…

September 15, 2023

TDK offers mechanically decoupled ultrasonic modules for collision avoidance

September 14, 2023 TDK Corporation (TSE:6762) presents the ultrasonic sensor module USSM1.0 PLUS-FS, in which the sensor element is mechanically decoupled from the housing. This makes…

September 15, 2023

element14 Community and Microchip launch the “Upcycle IoT” Design Challenge

Chicago – September 13, 2023: element14, an Avnet Community, in collaboration with Microchip, recently launched the “Upcycle IoT” Design Challenge, a pioneering initiative aimed at inspiring the…

September 15, 2023

Microchip Teams Up with Intelligent Hardware Korea (IHWK) to Develop an Analog Compute Platform to Accelerate Edge AI/ML Inferencing

CHANDLER, Ariz., Sept. 13, 2023 — To address the rapid rise of Artificial Intelligence (AI) computing at the edge of the network and its associated inferencing…

September 15, 2023

Archives: News

Autonomous and fully connected, software-defined vehicles are the future of the automotive industry and a new alliance on a standardized high-performance data transmission system makes them a reality

Synopsys Demonstrates Industry’s First Interoperability of PCI Express 6.0 IP with Intel’s PCIe 6.0 Test Chip

Nanusens technology is key to enabling AI to be smarter

Cadence Accelerates On-Device and Edge AI Performance and Efficiency with New Neo NPU IP and NeuroWeave SDK for Silicon Design

TDK offers mechanically decoupled ultrasonic modules for collision avoidance

element14 Community and Microchip launch the “Upcycle IoT” Design Challenge

Microchip Teams Up with Intelligent Hardware Korea (IHWK) to Develop an Analog Compute Platform to Accelerate Edge AI/ML Inferencing

Cadence Unveils Next-Generation AI-Driven OrCAD X Delivering Up to 5X Faster PCB Design and Enabled with Cadence OnCloud

Alchip Collaborates With Arteris To Expand ASIC Design Services

Boost/SEPIC Controller from Diodes Incorporated Enables 50kHz LED-Wide PWM Dimming in Automotive Lighting Applications