News – Page 367 – EEJournal

element14 Community and Hackster launch Design Challenge to improve Little Free Libraries

Chicago – June 20, 2023: element14 and Hackster, two Avnet communities, announced the launch of the “Little Free STEM Library Design Challenge,” encouraging their communities of makers, designers…

June 27, 2023

Sierra Wireless Partners with Amdocs to Simplify Adoption of Private Networks

Vancouver, Canada – June 21, 2023 – Sierra Wireless, a subsidiary of Semtech Corporation (Nasdaq: SMTC) and world-leading IoT solutions provider, today announced it has partnered…

June 27, 2023

TE Connectivity partners with tacterion for smart connector and component solutions

SCHAFFHAUSEN, Switzerland / MUNICH, Germany – June 22, 2023 – TE Connectivity (TE), a world leader in connectivity and sensors, partners with tacterion, a leading tactile sensing…

June 27, 2023

STMicroelectronics adds lossless image compression and information sharing in TouchGFX UI design software for STM32 microcontrollers

Geneva, June 22, 2023 – STMicroelectronics has released TouchGFX 4.22 user-interface software with improvements that include advanced memory-saving image compression and built-in information sharing. TouchGFX 4.22 automatically…

June 27, 2023

Engine management and pneumatic seat systems: Infineon launches two XENSIV™ barometric air pressure sensors

Munich, Germany – 26 June, 2023 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) introduces two new XENSIV™ barometric air pressure (BAP) sensors: the…

June 27, 2023

STMicroelectronics’ galvanically isolated high-side switches with diagnostics control and protect industrial loads

Geneva, June 26, 2023 – STMicroelectronics has launched a family of octal high-side switches that combine galvanic isolation for robustness, RDS(on) below 260mΩ for energy efficiency, and…

June 27, 2023

element14 Community launches Experimenting with Supercapacitors Design Challenge

Chicago – June 22, 2023: element14, an Avnet Community, recently launched its Experimenting with Supercapacitors Design Challenge. This unique competition provides participants with the opportunity to…

June 26, 2023

SEMI 3D & Systems Summit 2023 Opens With Heterogeneous Integration for Smarter Systems in Focus

DRESDEN, Germany — June 26, 2023 — 3D integration and systems for semiconductor manufacturing applications will take center stage at SEMI 3D & Systems Summit as the event…

June 26, 2023

Wearable Devices to Showcase AI-based Wearable Technology for Smart Glasses at XR Fair Tokyo 2023

YOKNEAM ILLIT, ISRAEL, June 26, 2023 (GLOBE NEWSWIRE) — Wearable Devices Ltd. (Nasdaq: WLDS, WLDSW), a technology growth company specializing in AI-powered touchless sensing wearables,…

June 26, 2023

Powermat launches 600W wireless power platform to reduce costs of deploying wireless industrial, micro-mobility, robotics, medical and telecom systems

SANTA CLARA, CALIF. (PRWEB) JUNE 20, 2023 Powermat Technologies, the global wireless power pioneer that brought wireless charging to smartphones, cars and coffee shops, today announced…

June 26, 2023

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