News – Page 370 – EEJournal

SEGGER adds Stack Overflow Prevention (STOP) technology to Embedded Studio for ARM

Monheim am Rhein, Germany – June 16th, 2023 The latest release of SEGGER’s Embedded Studio for ARM comes with STOP tech-nology, designed by SEGGER to reliably prevent…

June 19, 2023

Compass UOL launches AI Cockpit with Gen AI

NEW YORK, JUNE 19, 2023 – Digital services company Compass UOL announced it has equipped its workforce of 6,000 software engineers with AI Cockpit, a…

June 19, 2023

Pasternack Introduces Industry-Leading Ruggedized Electromechanical Relay Switches

IRVINE, Calif. – Pasternack, an Infinite Electronics brand and a leading provider of RF, microwave and millimeter-wave products, has announced the release of its innovative…

June 19, 2023

DFSPI IP Core from DCD supports all serial memories available on the market.

Digital Core Design, the leading IP Core provider and System-on-Chip design house, presents its latest DFSPI IP Core for access to NOR and NAND Flash…

June 16, 2023

New In-Chassis Recorder Module Brings Compact Data Storage Solution to Curtiss-Wright Axon/ADAU Flight Test Instrumentation Systems

European Test & Telemetry Conference (ETTC) Toulouse, France (Booth #20/21) – June 14, 2023 – Curtiss-Wright’s Defense Solutions division, today announced that it has expanded the capabilities of…

June 16, 2023

Synopsys and Samsung Collaborate to Deliver Broad IP Portfolio Across All Advanced Samsung Foundry Processes

Highlights: Synopsys Interface IP for the most widely used protocols, such as USB, PCI Express, 112G Ethernet, UCIe, LPDDR, DDR, MIPI and more, delivers high…

June 16, 2023

Imec’s novel ultra-wideband transceiver combines best-ranging precision with record low power consumption

LEUVEN (Belgium), JUNE 9, 2023 — At this week’s VLSI Technology Symposium, imec, a world-leading research and innovation hub in nanoelectronics and digital technologies, presents…

June 16, 2023

Next generation 1200 V CoolSiC™ Trench MOSFET in TO263-7 package boosts e-Mobility

Santa Clara, California – June 13, 2023 – Diodes Incorporated (Diodes) (Nasdaq: DIOD) will showcase at the PCI-SIG® Developers Conference in Santa Clara, CA a new…

June 16, 2023

VIAVI Unveils the Comprehensive and Versatile CX700 ComXpert for Automating Radio System Testing

Chandler, Ariz., June 13, 2023 – Viavi Solutions Inc. (VIAVI) (NASDAQ: VIAV) today introduced the CX700 ComXpert Radio Test System. This radio test solution revolutionizes testing for radio manufacturers as well…

June 15, 2023

New MEMS-based RF multiplexers from Pickering Interfaces deliver 300x operational life and 60x test system throughput

Pickering Interfaces, the leading supplier of modular signal switching & simulation solutions for use in electronic test & verification, announced today at IMS a new…

June 15, 2023

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