Archives: News
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Synopsys and TSMC Collaborate to Jumpstart Designs on TSMC’s N2 Process with Optimized EDA Flows
MOUNTAIN VIEW, Calif., April 25, 2023 /PRNewswire/ — In a continuing effort to meet stringent design targets for next-generation system-on-chips (SoCs) Synopsys, Inc. (Nasdaq: SNPS) today announced a collaboration with…
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Synopsys, TSMC and Ansys Strengthen Ecosystem Collaboration to Advance Multi-Die Systems
MOUNTAIN VIEW, Calif., April 24, 2023 /PRNewswire/ — Accelerating the integration of heterogeneous dies to enable the next level of system scalability and functionality, Synopsys, Inc. (Nasdaq: SNPS) has strengthened…
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Cadence Accelerates Hyperscale SoC Design with Next-Generation 112G Extended Long-Reach SerDes IP on TSMC’s N4P Process
Highlights: • DSP-based, flexible-rate SerDes IP is optimized for PPA for next-generation cloud networking, AI/ML, and 5G wireless applications • New architecture delivers exceptional ELR…
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Purdue researchers build transparent conductors without expensive rare-earth indium
WEST LAFAYETTE, Ind. – Purdue University researchers have created transparent organic conductors from patent-pending polymers that achieve the same results and properties as traditional conductors…
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Cadence Tapes Out 16G UCIe Advanced Package IP on TSMC’s N3E Process Technology
SAN JOSE, Calif., April 24, 2023 — Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced the tapeout of Cadence® 16G UCIe™ 2.5D advanced package IP on…