News – Page 395 – EEJournal

Saelig Debuts Mix-and-Match RF Design System

Fairport, NY: Saelig Company, Inc. has introduced BeeWave – a novel wireless front-end concept that allows users to build complete, functioning complex RF circuits on a desktop without…

April 17, 2023

CEA-Leti to Report Progress on 3D Interconnects for Wafer-Level Platforms At Electronic Components and Technology Conference, May 30-June 2

GRENOBLE, France – April 13, 2023 – CEA-Leti will present seven papers on 3D interconnects focused primarily on semiconductor wafer-level platforms at the Electronic Components and Technology Conference (ECTC), May…

April 17, 2023

SatixFy and Presto Engineering Partner to Test and Qualify Radiation Hardened Space-Grade ASICs for Next-Gen Satellite Communications

Rehovot, Israel – April 13, 2023 – SatixFy Communications Ltd. (“SatixFy”) (NYSE AMERICAN: SATX), a leader in next-generation satellite communication systems based on in-house developed chipsets, is pleased…

April 17, 2023

Curtiss-Wright Expands Capabilities of PacStar® IQ-Core® Software Suite for Tactical Communications

ASHBURN, Va. – April 13, 2023 – Curtiss-Wright’s Defense Solutions division, a leading developer and supplier of advanced Modular Open Systems Approach (MOSA) communications solutions for the U.S.…

April 17, 2023

PREMO releases Cutting-Edge Inductive Couplers for Electric Vehicle Sniffing / CCS listener Applications, Revolutionizing High-Voltage System Monitoring. New MICU 300A-S/LF Series.

PREMO, a leading manufacturer of inductive components, has unveiled its latest breakthrough product – the MICU 300A-S/LF series of inductive couplers, designed specifically for electric…

April 17, 2023

Archives: News

Saelig Debuts Mix-and-Match RF Design System

CEA-Leti to Report Progress on 3D Interconnects for Wafer-Level Platforms At Electronic Components and Technology Conference, May 30-June 2

SatixFy and Presto Engineering Partner to Test and Qualify Radiation Hardened Space-Grade ASICs for Next-Gen Satellite Communications

Curtiss-Wright Expands Capabilities of PacStar® IQ-Core® Software Suite for Tactical Communications

PREMO releases Cutting-Edge Inductive Couplers for Electric Vehicle Sniffing / CCS listener Applications, Revolutionizing High-Voltage System Monitoring. New MICU 300A-S/LF Series.

Curtiss-Wright Debuts New Low-Cost Rugged Mission Touchscreen Display Impervious to Water and Dust

Hi-Lo Systems supports Infineon’s OPTIGA™ TPM firmware programming to accelerate device manufacturers’ time-to-market

Lam Research AI Study Identifies Game-Changing Development Approach for Speeding Up, Slashing Cost of Chip Innovation

Semtech Expands PerSe® Product Portfolio with Launch of New Chipset for 5G Mobile Devices

Bel Fuse Introduces New Line of Fast-acting Fuses for Hazardous Environments