Archives: News
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Sony Semiconductor Israel Redefines IoT Connectivity Platform with New Ultra Low Power 5G LPWA ALT1350 Chipset
Sony Semiconductor Israel (Sony), a leading provider of cellular IoT chipsets, announced the launch of the ALT1350 for the global market. The ALT1350 is the world’s…
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STMicroelectronics achieves EMVCo certification for biometric-payment platform, cutting time-to-market for card issuers
Geneva, November 28, 2022 – STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, has announced it has completed EMVCo[1] certification…
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LoRa Alliance® Expands Certification Program to Include SCHC over LoRaWAN® Enabling IPv6 Solutions
Fremont, Calif. – November 28, 2022 – The LoRa Alliance®, the global association of companies backing the open LoRaWAN® standard for Internet of Things (IoT) low-power wide-area networks (LPWANs), today…
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Keysight to Spotlight Solutions that Accelerate 6G Innovations at IEEE Globecom 2022
What: In the innovation age, technology advancements are always in development. The next generation of cellular technology will make huge improvements in bandwidth utilization, data delivery,…
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Nexperia releases ultrafast 650 V Recovery Rectifiers for automotive and industrial applications
Nijmegen, November 21st, 2022: Nexperia, the expert in essential semiconductors, today announced the expansion of its portfolio of Clip-bonded FlatPower (CFP) packaged diodes for industrial and…
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Infineon achieves ISO/SAE 21434 process certification; AURIX™ TC4xx microcontroller family first to be standard-certified
Munich, Germany – 21 November, 2022 – Introduced by the United Nations Economic Commission for Europe (UNECE), the new UN R155 regulation addresses the increasing…
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Saelig Introduces Coltraco Portasonic® PRO Handheld Ultrasonic Non-invasive Clamp-on Flow Meter With Pressure Prediction
Fairport, NY: Saelig Company, Inc. has introduced the Coltraco Portasonic® PRO which uses ultrasonic technology to non-invasively determine the fluid flow and internal pressure within carbon steel, stainless steel,…
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Hundreds of Renesas’ Intersil-Brand Radiation-Hardened ICs Lift Off Onboard Artemis 1 Mission to the Moon
Düsseldorf, November 18, 2022 ― Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, announced that hundreds of its radiation-hardened (rad-hard) integrated circuits (ICs), including over…
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Nexperia launches new hotswap Application Specific MOSFETs (ASFETs) with double the improvement in SOA
Nijmegen, November 18th, 2022: Nexperia, the expert in essential semiconductors, today extends its ‘ASFETs for Hotswap and Soft Start’ portfolio with the introduction of 10 new…
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Infineon launches the industry’s first PFC and hybrid flyback combo IC driving performance in GaN-based USB-C adapters and chargers with EPR
Munich, Germany – 15 November, 2022 – USB power delivery (USB-PD) has emerged as the prevailing standard for fast charging and for supplying power to…