News – Page 461 – EEJournal

Infineon launches XMC7000 series for industrial applications with increased performance, memory, advanced peripherals, and extended temperature range

Munich, Germany – 9 November, 2022 – At electronica 2022, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) launches the XMC7000 microcontroller (MCU) family for…

November 10, 2022

Mercury introduces radiation-tolerant 8GB DDR4 memory component to power enhanced edge processing for space missions

ANDOVER, Mass., Nov. 08, 2022 (GLOBE NEWSWIRE) — Mercury Systems, Inc. (NASDAQ: MRCY, www.mrcy.com), a leader in trusted, secure mission-critical technologies for aerospace and defense, today…

November 10, 2022

Keysight, NOKIA Bell Labs Collaborate to Accelerate 5G-Advanced and 6G Communications

SANTA ROSA, Calif. November 9, 2022 Keysight Technologies, Inc. (NYSE: KEYS), a leading technology company that delivers advanced design and validation solutions to help accelerate…

November 10, 2022

EMA Design Automation Announces New Support+ Program for Cadence Customers

Rochester, NY (November 9, 2022) – EMA Design Automation® (www.ema-eda.com), a full-service provider and innovator of Electronic Design Automation (EDA) systems solutions, is pleased to announce…

November 10, 2022

PICMG ratifies COM Express 3.1 specification to support ultra high-speed serial interfaces

WAKEFIELD, MA., NOVEMBER 09, 2022. PICMG, a leading consortium for the development of open embedded computing specifications, announces that the new COM Express 3.1 specification has…

November 10, 2022

Curtiss-Wright Showcases Industry-Leading Flight Test Instrumentation Hardware and Software Solutions at International Telemetering Conference (ITC) 2022

INTERNATIONAL DATA LINK SYMPOSIUM (IDLS 2022), HALIFAX, NOVA SCOTIA (Booth #1) – November 8, 2022 – Curtiss-Wright’s Defense Solutions division, a trusted, proven supplier of tactical data link (TDL) software…

November 9, 2022

CETECOM, experts in RF connectivity, launches the first-ever Automotive Experience Lab

MILPITAS, Calif., Nov. 1, 2022 – CETECOM, Inc., a global company providing automotive test and certification services, announces the first-of-its-kind Automotive Experience Lab (AEL). This…

November 9, 2022

TE Connectivity lends its industry and engineering expertise to TUC.technology development to help create next-generation modular interior applications for the vehicles of the future

WINSTON-SALEM, N.C. – Nov. 8, 2022 – As the world shifts its sights to autonomous and electric vehicles, TE Connectivity (TE), a world leader in…

November 9, 2022

POLYN Technology, Edge Impulse Join Forces to Advance Tiny AI Products

CAESAREA, Israel – POLYN Technology, a fabless semiconductor company providing Neuromorphic Analog Signal Processing (NASP) Tiny AI chips, and Edge Impulse, the leading embedded machine-learning (ML) development…

November 9, 2022

OMNIVISION Announces First Miniature 2-megapixel CMOS Image Sensor in Square Format for Disposable and Reusable Endoscopes

SANTA CLARA, Calif. – November 8, 2022 – OMNIVISION, a leading global developer of semiconductor solutions, including advanced digital imaging, analog, and touch & display technology, today announced the OH02B…

November 9, 2022

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