News – Page 502 – EEJournal

NXP Collaborates with Foxconn on Next Generation Vehicle Platforms

EINDHOVEN, The Netherlands, July 20, 2022 (GLOBE NEWSWIRE) – NXP Semiconductors (NASDAQ: NXPI) today announced that it has signed a memorandum of understanding with Hon Hai…

July 20, 2022

Volkswagen’s CARIAD and STMicroelectronics to co-develop chip for software-defined vehicles

Securing Tier 3 supply: CARIAD, TSMC, and ST plan that TSMC will manufacture the system-on-chip wafers for STMicroelectronics (ST). Innovative basis: The new co-developed system-on-chip…

July 20, 2022

Rohde & Schwarz announces on-wafer device characterization test solution

Rohde & Schwarz now offers a test solution for full RF performance characterization of the DUT on-wafer which combines the powerful R&S ZNA vector network…

July 19, 2022

Ultra Librarian Launches Autodesk Fusion 360- Integrated CAD Library App on Autodesk App Store

Rochester, NY (July 19, 2022)—Ultra Librarian®, (ultralibrarian.com) the world’s largest CAD library provider, today announced the release of the Ultra Librarian app on the Autodesk…

July 19, 2022

Innoscience signs distribution agreement with Finepower providing European & Chinese customers with specialist design-in support

19th July 2022 – Innoscience Technology, a company founded to create a global energy ecosystem based on high-performance, low-cost gallium-nitride-on-silicon (GaN-on-Si) power solutions, has signed a distribution agreement…

July 19, 2022

Posifa Technologies Introduces New PVC4100 Fully Calibrated MEMS Pirani Vacuum Transducer Designed for Cost-Effective OEM Integration

SAN JOSE, Calif. — July 19, 2022 — Posifa Technologies today introduced its new PVC4100 series fully calibrated MEMS Pirani vacuum transducer. Designed for cost-effective OEM…

July 19, 2022

Archives: News

NXP Collaborates with Foxconn on Next Generation Vehicle Platforms

Volkswagen’s CARIAD and STMicroelectronics to co-develop chip for software-defined vehicles

Rohde & Schwarz announces on-wafer device characterization test solution

Ultra Librarian Launches Autodesk Fusion 360- Integrated CAD Library App on Autodesk App Store

Innoscience signs distribution agreement with Finepower providing European & Chinese customers with specialist design-in support

Posifa Technologies Introduces New PVC4100 Fully Calibrated MEMS Pirani Vacuum Transducer Designed for Cost-Effective OEM Integration

Flex Logix Partners with Intrinsic ID to Secure eFPGA Platform

Keysight Technologies Announces Student Finalists for Innovation Challenge

Motor-drive reference designs from STMicroelectronics include STSPIN32 and production-ready PCB

Sensata Technologies Develops Passive Inceptor for the Advanced Air Mobility Market