News – Page 511 – EEJournal

STMicroelectronics releases next-generation Bluetooth® system-on-chip, enhanced with latest positioning capabilities

Geneva, June 28, 2022 – STMicroelectronics has introduced its third-generation Bluetooth® System-on-Chip (SoC), enhanced with Bluetooth direction finding technology for location-tracking and real-time positioning applications. By determining the…

June 28, 2022

Enhanced Serial Peripheral Interface (eSPI) Master/Slave Controller

DCD-SEMI, a leading IP Core provider and SoC design house from Poland has mastered unique DeSPI IP Core. It is a fully configurable eSPI master/slave…

June 28, 2022

CUI Devices Adds New Circular Cable Assemblies Product Line

LAKE OSWEGO, Ore. — June 28, 2022 — CUI Devices’ Interconnect Group today announced the introduction of circular cable assemblies to its cable assemblies portfolio. Available in M12 connector types, CUI Devices’ CDM12…

June 28, 2022

New Pixus SlotSaver SOSA™ Aligned Chassis Manager Plugs Into Rear Side of Backplane

Waterloo, Ontario — June 27, 2022 – Pixus Technologies, a provider of embedded computing and SOSA aligned enclosure solutions, is now offering a SOSA aligned…

June 28, 2022

element14 Celebrates the “Summer of Sensors” with Series of Four Design Challenges

Chicago – June 28, 2022: element14, an Avnet community, is continuing its “Summer of Sensors” with a series of four design challenges that encourage participants to…

June 28, 2022

Macronix Octaflash UW Series Memory Provides High-Density Flash Solutions for NXP S32Z and S32E Real-Time Processors

TAIPEI, Taiwan – June 28, 2022 — Macronix International Co., Ltd. (TSE: 2337) today announced that Macronix’s MX25UW high efficiency octaflash flash memory family has…

June 28, 2022

Liquid Instruments Brings Additional Capabilities and Flexibility to Engineering and Education Test Solutions

Adds Protocol Analyzer, Multi-Instrument Mode and FPGA Programmability to Moku:Go Improves Phasemeter and Frequency Response Analyzer for Moku:Pro SAN DIEGO and CANBERRA, Australia, June 28,…

June 28, 2022

Siemens to show integrated technologies accelerating decarbonization of buildings

Highlight: sustainable hydrogen solution for residential boilers Intelligent, digitalized heat interface unit for multi-family apartment buildings LMV6 burner management system for medium and high capacity…

June 28, 2022

Avery Design Systems PCI Express VIP Enables eTopus SerDes IP and Next-Generation ASIC and Chiplet applications to Achieve Compliance and High-Speed Connectivity

Tewksbury, MA., June 21, 2022 — Avery Design Systems, a leader in functional verification solutions, today announced it has been chosen by eTopus as its verification IP…

June 28, 2022

onsemi Advances Industrial Ethernet with 10BASE-T1S Controller

PHOENIX – June 21, 2022 – onsemi (Nasdaq: ON), a leader in intelligent power and sensing technologies, today announced a new 10BASE-T1S Ethernet controller designed to provide reliable…

June 28, 2022

Archives: News