Archives: News
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Cadence Digital and Custom/Analog Design Flows Certified by TSMC for Latest N3E and N4P Processes
Highlights: • Companies collaborate to accelerate next-generation mobile, AI and hyperscale design innovation • Customers actively designing with new N3E and N4P PDKs • Cadence…
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Controlled Fabrication of Multimetallic Building Blocks for Hybrid Nanomaterials
Polymers with different metal complexes in their side chains are thought to be promising high-performance materials with a wide variety of applications. However, conventional fabrication…
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Universal programmer/debugger uniquely enables Wi-Fi operation
June 2022: MikroElektronika (MIKROE), the embedded solutions company that dramatically cuts development time by providing innovative hardware and software products based on proven standards, has launched UNI CODEGRIP,…
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STMicroelectronics reveals a ready-to-use In-Vehicle system-on-chip solution for Secure Car Access CCC Release 3 compliant
Combines ST secure element based on certified ST33K-A secure IC and Java® Card platform with G+D Digital Key® applet to provide system-on-chip solution for secure car access…
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Synopsys Drives Chip Innovation for Next-Generation Mobile and HPC Designs on TSMC N3E and N4P Processes
MOUNTAIN VIEW, Calif., June 13, 2022 /PRNewswire/ — Helping customers optimize performance, power and area (PPA) for next-generation system-on-chips (SoCs) used in demanding mobile and high-performance computing applications, Synopsys,…