News – Page 594 – EEJournal

CEVA Bluebud™ Platform Takes Center Stage for a Differentiated, Premium Wireless Audio Experience in TWS Earbuds, Gaming Headsets, Hearables, Wearables and More

• New Bluebud-HD, a pre-configured software package for the Bluebud platform, features immersive audio, wideband voice conversation, always-on voice assistant, assistive hearing, and IMU-based contextual…

January 5, 2022

Mobix Labs Introduces Full Line of True Xero Active Optical, Direct Attach Cables and Transceivers

IRVINE, Calif., Jan. 04, 2022 (GLOBE NEWSWIRE) — Mobix Labs Inc., a global connectivity solutions provider for wireless mmWave 5G and wired high bandwidth cable networks, today introduced its new…

January 4, 2022

ACEINNA INS401 Inertial Navigation System (INS) and GNSS/RTK Turnkey Solution for ADAS and Autonomous Vehicle (AV) Precise Positioning

CES, Las Vegas, NV – January 4, 2022 Booth 3633 – Tech East –LVCC West Hall ACEINNA Inc. (pronounced “A See Nah”), today announced the INS401…

January 4, 2022

emotion3D and onsemi Collaborate on Innovative Driver and Occupant Monitoring System Reference Design

LAS VEGAS – Jan. 4, 2022 – emotion3D, a leading provider of camera-based automotive in-cabin analysis software, and onsemi (Nasdaq: ON), a leader in intelligent power…

January 4, 2022

NXP Advances IoT Connectivity with Industry’s First Secure Tri-Radio Device

Industry’s first monolithic tri-radio family to support Wi-Fi 6, Bluetooth® 5.2 and 802.15.4, enables simultaneous transmit and receive for higher performance in smart solutions •Supports…

January 4, 2022

ADLINK launches COM-HPC Client Type and COM Express Type 6 Modules with 12th Gen Intel® Core™ processors

Summary: •Advanced hybrid architecture features up to six Performance-cores (P-cores) that enhance single-threaded throughput for IoT workloads and up to eight Efficient-cores (E-cores) for background…

January 4, 2022

GOWIN Automotive-grade FPGAs Pass SAIC’s 2500h Heat Resistance Tests

SAN JOSE, Calif., Dec. 16, 2021 (GLOBE NEWSWIRE) — GOWIN Semiconductor Corp. and Shanghai Automobile Transmission announced that GOWIN Semiconductor’s automotive-grade FPGAs passed SAIC’s 2500h…

January 4, 2022

New SPSCAP additions result in greater breadth of supercapacitors available via Transfer Multisort Elektronik

December 20, 2021, Łódź, Poland – Transfer Multisort Elektronik (TME), the Poland-based component distributor, has further strengthened its portfolio of supercapacitors with the addition of 15 new…

January 3, 2022

SmarteCAM – a ready-to-deploy smart AI camera from e-con Systems is now listed on AWS partner device catalog!

San Jose and Chennai (November 29, 2021) – e-con Systems’ SmarteCAM, a ready to deploy smart AI camera system has now been validated by the AWS Device Qualification Program…

January 3, 2022

HERE releases global library of terrestrial lidar data for real-world 3D modeling applications

Laser-based measurement at foundation of “digital twin” technology and high-definition mapping applications. HERE Lidar Data available for 50+ countries in LAS and LAZ data formats. CES 2022 – HERE Technologies, the leading location data and technology platform, today announced the company’s global library of three-dimensional lidar data (Light Detection…

January 3, 2022

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