News – Page 606 – EEJournal

Vishay Intertechnology Automotive Grade IHSR High Temperature Inductor Delivers Ultra Low DCR, High Current Filtering in 2525 Case Size for Multi-Phase Power Supplies

MALVERN, Pa., Dec. 01, 2021 (GLOBE NEWSWIRE) — Vishay Intertechnology, Inc. (NYSE: VSH) today introduced a new AEC-Q200 qualified IHSR high temperature inductor in the…

December 2, 2021

ROHM’s New Thick Film Shunt Resistors: Featuring Industry-Leading 4W Rated Power

Santa Clara, CA and Kyoto, Japan, Nov. 30, 2021 (GLOBE NEWSWIRE) — ROHM Semiconductor today introduced their new thick-film shunt resistors, LTR100L, optimized for industrial and consumer applications. Often used to…

December 2, 2021

New u-blox AWS IoT ExpressLink Modules Offer Out-of-the-Box Secure Connectivity to the AWS Cloud

Thalwil, Switzerland – November 30, 2021 – u-blox (SIX:UBXN), a leading global provider of positioning and wireless communication technologies and services, has announced two modules designed…

December 2, 2021

CUI Devices Introduces HDMI Connectors Line to Connectors Portfolio

LAKE OSWEGO, Ore. — December 1, 2021 — CUI Devices’ Interconnect Group today announced the addition of HDMI connectors to its connectors product portfolio. Available in Type A and mini receptacle…

December 2, 2021

ADLINK releases its first SMARC module based on Qualcomm QRB5165 enabling high performance robots and drones at low power

ADLINK Technology Inc., a global leader in edge computing, released the LEC-RB5 SMARC module –its first SMARC AI-on-Module based on a Qualcomm Technologies, Inc. processor. The Qualcomm QRB5165…

December 2, 2021

Cadence Expands Collaboration with TSMC and Microsoft to Accelerate Timing Signoff for Giga-Scale Designs on the Cloud

Highlights: • Customers benefit from improved productivity and scalability with Cadence signoff solutions and TSMC technology on the Microsoft Azure cloud with the Cadence CloudBurst…

December 2, 2021

Hprobe Announces New Generation of Magnetic Test Head for Wafer Sort of MRAM in Mass Production

Grenoble, France, November 30, 2021 – Hprobe, a provider of turnkey semiconductor Automatic Test Equipment (ATE) for magnetic devices, today announced a breakthrough magnetic test head revolutionizing MRAM…

December 2, 2021

Infineon’s AIROC™ Cloud Connectivity Manager supports the AWS IoT ExpressLink to make IoT product development simple and quick

Munich, Germany, and San Jose, California – 30 November, 2021 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) today announced the company’s new AIROC™…

December 1, 2021

Silicon Designs Introduces Low-G Series of MEMS DC Accelerometer Chips

November 30, 2021, Kirkland, Washington, USA – Silicon Designs, Inc. (www.SiliconDesigns.com) today announced the global market launch of its Model 1525 Low-G Series of MEMS DC accelerometer chips,…

December 1, 2021

FortifyIQ Sets the Stage at the Design Automation Conference for Revolutionizing Chip Design with Pre-silicon Security Verification

NEWTON, MA – November 30, 2021 – FortifyIQ, the leader in pre-silicon security verification solutions, will showcase the company’s recently announced solutions SideChannel Studio and FaultInjection Studio at the upcoming Design Automation…

December 1, 2021

Archives: News