News – Page 616 – EEJournal

Renesas Expands Lineup of 28nm Cross-Domain Automotive Control Microcontrollers

Düsseldorf, November 9, 2021 ― Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today introduced a powerful new group of microcontrollers (MCUs), the RH850/U2B MCUs,…

November 9, 2021

NXP’s i.MX 93 Applications Processor Family Powers a New Era of Secure Edge Intelligence

• Fast, efficient, low-cost machine learning acceleration enables IoT, automotive and industrial edge applications with the industry’s first implementation of the Arm® Ethos™-U65 microNPU. •…

November 9, 2021

ADLINK launches first embedded MXM graphics modules based on NVIDIA Ampere architecture for edge computing and AI

Summary: ● ADLINK EGX-MXM-A1000, EGX-MXM-A2000 and EGX-MXM-A4500 are the first modules to use NVIDIA’s embedded GPUs based on NVIDIA Ampere architecture ● ADLINK embedded MXM…

November 9, 2021

CUI Devices Adds Tactile Switches Product Line to Switches Portfolio

LAKE OSWEGO, Ore. — November 9, 2021 — CUI Devices’ Switches Group today announced the addition of tactile switches to its product portfolio, which boast industry-best lead times. Ideal…

November 9, 2021

OmniVision Announces Its First RGBC Sensor with Always-on Capability for Front Facing Mobile Phone Cameras

SANTA CLARA, Calif. – November 9, 2021 – OmniVision Technologies, Inc., a leading developer of advanced digital imaging solutions, today announced the OV32C, a 32 megapixel (MP)…

November 9, 2021

TDK offers robust differential pressure transmitters for industrial applications

November 9, 2021 — TDK Corporation (TSE:6762) extends its MiniCell® range to include pressure transmitters in robust stainless-steel casing to measure differential pressure in industrial…

November 9, 2021

Variscite and Hailo Partner to Provide Out-of-the-Box, Full-Scale, Edge AI Solutions

Tel Aviv, Israel, November 08, 2021 – Variscite, a leading global provider of trusted Systems on Module (SoM) solutions for the embedded market, today announced its…

November 8, 2021

NXP Accelerates 5G Infrastructure with Low Power Dual-Channel Receive Front End Modules and Pre-Drivers

What’s new: NXP® Semiconductors has announced the new BTS6302U/6201U pre-drivers and BTS7203/5 dual-channel receive (RX) front end modules (FEM) for 5G massive multi-input multi-output (MIMO)…

November 8, 2021

Advantest Launches New Channel Cards, Adding Software-Based Functional Test and HSIO SCAN Test to the V93000 Platform

TOKYO, Nov. 08, 2021 (GLOBE NEWSWIRE) — Leading semiconductor test equipment supplier Advantest Corporation (TSE: 6857) has launched its new Link Scale™ family of digital…

November 8, 2021

Nexperia expands its wide bandgap semiconductor offering with new family of high-performance Silicon Carbide (SiC) Diodes

Nijmegen, November 8th, 2021: Nexperia, the expert in essential semiconductors today announced its entry into the high-power Silicon Carbide (SiC) diodes market with the introduction of 650…

November 8, 2021

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