News – Page 621 – EEJournal

Cadence Integrity 3D-IC Platform Supports TSMC 3DFabric Technologies for Advanced Multi-Chiplet Designs

Highlights: ● The Cadence 3D-IC solution centers on the Integrity 3D-IC platform, which provides integrated planning, implementation and system analysis to optimize PPA for multi-chiplet…

October 27, 2021

Infineon introduces high precision coreless current sensor XENSIV™ TLE4972 for automotive applications

Munich, Germany – 27 October, 2021 – Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) launches its first automotive current sensor: the new XENSIV™ TLE4972.…

October 27, 2021

Cadence Demonstrates IP Test Silicon for PCI Express 6.0 Specification on TSMC N5 Process

SAN JOSE, Calif., October 27, 2021—Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced the immediate availability of Cadence® IP supporting the PCI Express® (PCIe®) 6.0…

October 27, 2021

New release of Imagimob tinyML platform enables developers to build AI models in minutes

Imagimob today announced that the new release of its tinyML platform is now available to its customers. The new release focuses on making it easier…

October 27, 2021

CUI Devices Introduces Industry’s Smallest Micro Buzzer

LAKE OSWEGO, Ore. — October 27, 2021 — CUI Devices’ Audio Group today announced the introduction of a 3.2 mm x 3.2 mm magnetic transducer buzzer, making…

October 27, 2021

Semtech Announces Intelligent Sensor Platform, PerSe™, Improving Mobile Connectivity and Compliance for Personal Connected Consumer Devices

CAMARILLO, Calif., Oct. 27, 2021 – Semtech Corporation (Nasdaq: SMTC), a leading global supplier of high performance analog and mixed-signal semiconductors and advanced algorithms, announced its PerSe™ line of sensors targeted for the personal connected…

October 27, 2021

Archives: News

Cadence Integrity 3D-IC Platform Supports TSMC 3DFabric Technologies for Advanced Multi-Chiplet Designs

Infineon introduces high precision coreless current sensor XENSIV™ TLE4972 for automotive applications

Cadence Demonstrates IP Test Silicon for PCI Express 6.0 Specification on TSMC N5 Process

New release of Imagimob tinyML platform enables developers to build AI models in minutes

CUI Devices Introduces Industry’s Smallest Micro Buzzer

Semtech Announces Intelligent Sensor Platform, PerSe™, Improving Mobile Connectivity and Compliance for Personal Connected Consumer Devices

congatec introduces new platforms and design strategies for 5G connected mobile and stationary devices

Renesas’ Innovative Automotive Chips Drive Next-Generation Multimedia System for Toyota Lexus

Movandi Announces 5G mmWave Large 300+ Antenna Array Using TSMC Bulk CMOS Technology for Infrastructure Applications

TDK develops industry’s highest rated current inductors for automotive Power over Coax systems