Archives: News
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Hokuyo, SiLC Technologies Collaborate to Bring 4D LiDAR Technology to Industrial Automation and Robotics Applications
September 21, 2021 10:00 ET | Source: SiLC Technologies, Inc. OSAKA, Japan and MONROVIA, Calif., Sept. 21, 2021 (GLOBE NEWSWIRE) — Hokuyo Automatic Co., Ltd., a global…
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Melexis and emotion3D combine DMS and HUD dynamic object alignment in a single camera
Tessenderlo, Belgium, 20 September 2021 – Melexis, a global leader in automotive semiconductors, and emotion3D, a leading provider of camera-based automotive in-cabin analysis software, have…
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Working Smarter: Leveraging Machine Learning to Optimize CO2 Adsorption
Biomass waste can be used to produce porous carbons capable of sequestering CO2 gas emitted from large point sources (e.g., power plants, cement industries). However,…
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CommAgility 5G NR Hardware and Software selected by Shared Spectrum for DoD 5G Project
Parsippany, New Jersey, USA, Sept. 20, 2021 – Wireless Telecom Group (NYSE American: WTT) announced that Shared Spectrum Company (SSC), a leading innovator of spectrum intelligence software and solutions,…
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Reduce Switching Losses up to 50% While Accelerating Time to Market with the First Fully Configurable Digital Gate Driver for Silicon Carbide MOSFETs – Now Production Ready
CHANDLER, Ariz., Sept. 20, 2021 – As demand for electric buses and other electrified heavy transport vehicles increases to meet lower emission targets, silicon carbide-based power…
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STMicroelectronics Boosts Wireless Charging Speed, Efficiency, and Flexibility with 70W High-Power Chipsets
Geneva, September 20, 2021 – STMicroelectronics’ STWLC98 integrated wireless power receiver delivers faster wireless charging and flexible charge sharing for diverse portable and mobile devices for home, office, industry,…
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Synopsys Advances Processor IP Leadership with New ARC DSP IP Solutions for Low-Power Embedded SoCs
MOUNTAIN VIEW, Calif., Sept. 20, 2021 /PRNewswire/ — Highlights of this Announcement: Synopsys ARC 128-bit VPX2 and 256-bit VPX3 DSP IP are based on same advanced VLIW/SIMD…
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LIGENTEC and X-FAB collaboration creates Europe’s largest capacity foundry service for integrated photonic circuits
Tessenderlo, Belgium and Lausanne, Switzerland – September 14, 2021 LIGENTEC, pioneer in high-performance, low-loss, silicon nitride photonic solutions, and specialty semiconductor producer X-FAB Silicon Foundries…
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Industry IoT Consortium Launches Automotive Over-the-Air Updates Testbed
BOSTON, MA – SEPTEMBER 16, 2021 – The Industry IoT Consortium® (IIC™) announced the IIC Automotive Over-The-Air (OTA) Updates Testbed to show manufacturers how to deploy, update, and replace…
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AVX Launches New TCO Series High-Temperature, Automotive-Grade Polymer Chip Capacitors
FOUNTAIN INN, S.C. (September 16, 2021) – AVX Corporation, a leading manufacturer and supplier of advanced electronic components and interconnect, sensor, control, and antenna solutions, released…