News – Page 640 – EEJournal

Elma to Hold Functional Demos at U.S. Army FACE™ Technical Interchange Meeting (TIM)

FREMONT, Calif., September 2021 – At the upcoming U.S. Army FACE™ Technical Interchange Meeting (TIM) on September 14, Elma Electronic Inc. will participate in three functional demos…

September 13, 2021

Cadence Accelerates Intelligent SoC Development with Comprehensive On-Device Tensilica AI Platform

Highlights: • Domain-specific, extensible and configurable AI platform built upon mature, volume production-proven Tensilica architecture • Industry-leading performance and energy efficiency for on-device AI applications…

September 13, 2021

LDRA tool suite Selected to Keep Railway System Safety on Track

Wirral, UK—September 9, 2021—LDRA, the leader in standards compliance, automated software verification, software code analysis, and test tools, today announced that G.G.Tronics has chosen the LDRA tool suite…

September 10, 2021

Time-of-Flight 8×8 Multi-Zone Ranging Sensor from STMicroelectronics Enables Innovative Applications

Geneva, September 9, 2021 – STMicroelectronics has announced the first multi-zone FlightSense™ time-of-flight sensor to be offered for general-purpose applications, bringing sophisticated distance sensing to the full…

September 10, 2021

MicroAI™ and Silicon Labs to Deploy Edge-Native AI

DALLAS, TEXAS (September 9, 2021) – MicroAI, the pioneer in edge-native artificial intelligence (AI) and machine learning (ML) products, announced today that it has joined Silicon Labs’…

September 10, 2021

Efinix® Announces AEC-Q100 Qualification and Automotive Product Line Initiative

September 08, 2021 12:01 AM Eastern Daylight Time — SANTA CLARA, Calif.–(BUSINESS WIRE)–Efinix®, an innovator in programmable product platforms and technology, today announced AEC-Q100 qualification…

September 10, 2021

TDK offers new stray-field compensated 3D HAL® sensors with redundancy function and digital output interfaces

September 9, 2021 — TDK Corporation (TSE:6762) expands its Micronas 3D HAL® sensor portfolio with the Hall-sensors HAR 3900 and HAR 3930*. The products enable…

September 10, 2021

Teracom Launches TCW241 Ethernet IO Module

September 8, 2021 – Ruse, Bulgaria Teracom LTD today announced the availability of the highly reliable, affordable, and easy to integrate TCW241 Ethernet IO Module for a wide…

September 9, 2021

Microchip Unveils Industry’s Most Compact 1.6T Ethernet PHY with Up to 800 GbE Connectivity for Cloud Data Centers, 5G and AI

CHANDLER, Ariz., Sept. 8, 2021 — Routers, switches and line cards need higher bandwidth, port density and up to 800 Gigabit Ethernet (GbE) connectivity to handle…

September 9, 2021

Cadence and Samsung Accelerate 3nm Mixed-Signal Silicon

SAN JOSE, Calif., September 8, 2021—Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced that it has collaborated with Samsung Foundry to deliver qualified Mixed-Signal OpenAccess-ready…

September 9, 2021

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