News – Page 649 – EEJournal

Picocom Accelerates 5G Communications SoC Development with Cadence Palladium Emulation

SAN JOSE, Calif., August 18, 2021—Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced that Picocom has deployed the Cadence® Palladium® Enterprise Emulation Platform to accelerate…

August 20, 2021

Addionics Collaborates to Build Resilient U.K. Supply Chain for Next-Generation Batteries

August 18, 2021 07:00 AM Eastern Daylight Time TEL AVIV, Israel–(BUSINESS WIRE)–Addionics, a chemistry-agnostic battery technology company, today announced a partnership with the Centre of…

August 20, 2021

Cinch Connectivity Solutions Introduces C-ENX Modular Rectangular Connector Line for Aerospace

Lombard, IL [August 12, 2021] Cinch Connectivity Solutions, a Bel group company, and global leader in delivering reliable connectivity solutions announces the introduction of the C-ENX…

August 20, 2021

Lantronix Announces Ultra-Compact Open-Q System on Module Based on Qualcomm® QRB5165 to Power Advanced Robotics Innovations

IRVINE, Calif., Aug. 19, 2021 (GLOBE NEWSWIRE) — Lantronix Inc. (NASDAQ: LTRX), a global provider of secure turnkey solutions for the Internet of Things (IoT) and Remote…

August 19, 2021

ROHM’s New EMARMOUR™ Op Amps Series

Santa Clara, CA and Kyoto, Japan, Aug. 16, 2021 (GLOBE NEWSWIRE) — ROHM Semiconductor today announced the BD8758xY series (BD87581YG-C, BD87582YFVM-C) of rail-to-rail input/output high-speed CMOS op amps. The devices feature…

August 19, 2021

New Vishay Intertechnology Very Fast-Acting Thin Film Chip Fuse Offers AEC-Q200 Qualification for Automotive Applications

MALVERN, Pa., Aug. 18, 2021 (GLOBE NEWSWIRE) — Vishay Intertechnology, Inc. (NYSE: VSH) today introduced a new very fast-acting thin film chip fuse. For automotive…

August 19, 2021

Archives: News

Picocom Accelerates 5G Communications SoC Development with Cadence Palladium Emulation

Addionics Collaborates to Build Resilient U.K. Supply Chain for Next-Generation Batteries

Cinch Connectivity Solutions Introduces C-ENX Modular Rectangular Connector Line for Aerospace

Lantronix Announces Ultra-Compact Open-Q System on Module Based on Qualcomm® QRB5165 to Power Advanced Robotics Innovations

ROHM’s New EMARMOUR™ Op Amps Series

New Vishay Intertechnology Very Fast-Acting Thin Film Chip Fuse Offers AEC-Q200 Qualification for Automotive Applications

Trinamic’s 3-Phase MOSFET Gate Driver Maximizes Battery Life and Cuts Component Count by Half

Glass Bubbles from 3M Help Enable Designers to create Faster, More Reliable 5G Infrastructure and Devices

eSOL licences SEGGER emCompress for accelerating automotive firmware updates

WiBotic Introduces New Lineup of Chargers and Transmitters for Drones and Autonomous Mobile Robots