Archives: News
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New Highly Integrated Renesas PMIC Optimized For RZ/G2L And V2L MPUs Delivers Complete Power Solution To Reduce Design Time
Düsseldorf, August 5, 2021 ― Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today introduced the RAA215300 PMIC (Power Management IC) optimized to complement Renesas’…
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Knowles Releases AI-Enabled TWS Development Kit with Premium Features
ITASCA, Ill., August 5, 2021 — Knowles Corporation (NYSE: KN), a market leader and global provider of advanced micro-acoustic microphones and speakers, audio processing, and precision device solutions,…
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ADLINK Introduces SOSA-aligned, Robust 3U VPX Processor Blade with 11th Generation Intel® Core™ i7
Summary: 3U VPX module is based on 11th generation Intel® Core™ i7 processor technologies, formerly Tiger Lake-H, with enhanced data and graphics performance and artificial…
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Towards AIoT: Bosch Machine Learning Trials Go Live on Fetch.ai
Cambridge — Fetch.ai (https://fetch.ai/), a Cambridge-based artificial intelligence lab building an open-access decentralized machine learning network for smart infrastructure, announced today that the team of…
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Concurrent Technologies announces a new product based on the latest Intel® Xeon® W-11000E Series processor
Concurrent Technologies announces a new 3U VPX conduction-cooled plug in card based on the Intel® Xeon® W-11000E Series processor (formerly known as Tiger Lake-H) for…
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STMicroelectronics’ STM32U5 General-Purpose Microcontrollers Achieve PSA Certified Level-3 and SESIP3 Security Certifications
Geneva, August 4, 2021 – STMicroelectronics has announced PSA Certified Level-3 and SESIP[1]3 certifications for its general-purpose secure STM32U585* microcontroller, passing tests for logical, board, and basic physical…
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Intrinsic ID Partners with DARPA to Provide Streamlined Access to Industry-Leading PUF Technology
SUNNYVALE, Calif., August 3, 2021 – Intrinsic ID, the world’s leading provider of Physical Unclonable Function (PUF) security IP, today announced a partnership with the U.S. Defense Advanced…
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ADLINK Launches First COM Express Module Featuring Intel® Core™, Xeon® and Celeron® 6000 processors
ADLINK Technology Inc., a global leader in edge computing, today introduces its new Express-TL COM Express Type 6 module with Intel® Core™, Xeon® W and Celeron® 6000…
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ADLINK Launches First COM Express Module Featuring Intel® Core™, Xeon® and Celeron® 6000 processors
Summary: ● ADLINK’s Express-TL COM Express Type 6 module features 11th Generation Intel® Core™, Xeon® W, and Celeron® 6000 processors with up to 8 cores…
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First Aerospace-qualified Baseless Power Module Family Improves Aircraft Electrical System Efficiency
CHANDLER, Ariz., August 3, 2021 – In the race to reduce aircraft emissions, developers increasingly are moving toward more efficient designs including electrical systems that replace…